Actions Technology's Compute-in-Memory Triple-Core Heterogeneous Edge AI Chips Reach Cumulative Shipments of Millions of Units

[Editor's Note] As an annual benchmark event in the semiconductor industry, the 8th IC Top 100 List is positioned at a critical window of industrial technology iteration and domestic substitution. This year's list has been fully upgraded, featuring 70 heavyweight awards covering eight core fields including AI, embodied intelligence, and smart vehicles, with multiple special awards newly added and optimized. The judging panel is composed of over 100 semiconductor investment alliance units and 500+ industry CEOs, and the winners will be announced at the 2027 Semiconductor Investment Annual Conference Gala, striving to identify industry benchmarks and set up models of industry innovation.

[Candidate Enterprise] Actions Technology Co., Ltd. (referred to as "Actions Technology")

As AI accelerates from the cloud toward device-cloud collaboration, multimodal perception terminals with voice, vision, and multi-sensor fusion capabilities are experiencing explosive growth. Device-side AI applications such as AI audio, AI wearables, and AI office are being deployed at an accelerating pace, and device-side AI chips have become a new engine driving growth in the semiconductor industry. This track has also become key for Chinese chip design companies to achieve differentiated breakthroughs.

On this track, Actions Technology has grown into a globally leading designer of low-power device-side AIoT chips.

Founded in 2014, Actions Technology listed on the STAR Market in 2021 (stock code 688049.SH), is headquartered in Zhuhai, and has branches/subsidiaries in Shenzhen, Hefei, Chengdu, Hangzhou, Shanghai, Hong Kong, and other places. The company's main business covers device-side AI SoC chips, device-side AI processor chips, and supporting solutions. Its products broadly empower device-side AI application fields such as AI audio, AI wearables, and AI office, covering a rich range of terminal scenarios including wireless microphones, gaming headsets, Bluetooth speakers, party speakers, home theater audio systems, smartwatches, AI glasses, AI rings, AI Note, and desktop assistant robots.

At the technical level, Actions Technology has self-developed a high energy-efficiency AI NPU based on mixed-signal SRAM in-memory computing technology, driving the AI upgrade of terminals through underlying innovation that surpasses the traditional von Neumann architecture, and combining high-fidelity audio full-signal-chain technology with low-latency wireless connectivity technology to build differentiated competitive advantages in device-side AI chips.

At present, the cumulative shipments of the tri-core heterogeneous device-side AI chips ATS3231 series, ATS362X series, and ATW6095 series equipped with in-memory computing technology have reached millions of units, with large-scale deployment in nearly ten terminal scenarios including wireless microphones, gaming headsets, party speakers, live-streaming sound cards, desktop microphones, AI glasses, AI Note, and desktop assistant robots for leading global brands. The company has also become the first chip enterprise in the industry to achieve large-scale mass production of mixed-signal SRAM in-memory computing. In the first half of 2026, revenue from device-side AI SoC chips and device-side AI processor chips equipped with in-memory computing NPUs accounted for more than 25%.

Internationalization is another calling card of Actions Technology. In the branded Bluetooth speaker field, the company has long-term cooperation with mainstream domestic and international brands such as Harman, Sony, BOSE, LG, Xiaomi, and Logitech, and has become Harman's core strategic partner in the Bluetooth speaker chip field; in private-protocol audio fields such as wireless microphones, gaming headsets, and home theater audio systems, its products are deeply used by leading brands such as DJI, Moma, Insta360, RØDE, Razer, Samsung, and TCL; in the AI wearable market, it has successfully entered leading brands such as Xiaomi, HONOR, realme, and Nothing.

In this IC Top 100 List, Actions Technology is competing for the "Annual Semiconductor Listed Company Navigator Award" and the "Annual International Market Pioneer Award." The two awards respectively aim to recognize listed enterprises leading in comprehensive strength within the device-side AI chip sub-track in 2026, and enterprises in the globalized semiconductor industry with notable internationalization progress that have successfully opened up overseas markets.

[Award Application Entry]

The 2027 Semiconductor Investment Annual Conference and IC Top 100 List Award Ceremony will be held in December 2026. Award applications have been launched, and solicitation and candidate enterprise/institution reports are currently underway. Welcome to sign up and participate, and join us at the industry gala!

Aimed at recognizing listed enterprises leading in comprehensive strength within each semiconductor sub-track in 2026, covering all sub-fields such as chip design, wafer manufacturing, packaging and testing, semiconductor equipment, electronic materials, EDA/IP, power semiconductors, and third-generation semiconductors, with one benchmark leader selected for each track. Through steady operations, self-developed technical strength, market share, and governance level, enterprises lead the development of their tracks and drive the overall quality upgrade of the sector.

[Application Conditions]

1. The entity must be a compliant listed semiconductor enterprise at home or abroad, belonging to a clear and single sub-track, and operating normally and stably throughout 2026;

2. Its revenue scale, market share, and degree of core technology autonomy within the track rank among the industry's forefront, with stable and sustainable R&D investment;

3. Standardized corporate governance, complete and transparent financial report disclosure, no major violation penalties or major safety and operational accidents, and healthy cash flow and financial condition;

4. It plays an industry-leading role, actively driving industrial chain collaboration and the advancement of domestic substitution, and setting a model for the standardized development of listed semiconductor enterprises.

[Evaluation Criteria]

1. Track revenue scale, market share, and financial profitability performance 40%

2. Core self-developed technology, patent reserves, and effectiveness of domestic substitution breakthroughs 35%

3. Corporate governance, information disclosure, industrial chain leadership, and industry contribution 25%

[Annual International Market Pioneer Award]

Aimed at recognizing enterprises in the globalized semiconductor industry with notable internationalization progress that have successfully opened up overseas markets. As the globalization trend of the semiconductor industry grows increasingly strong, internationalization has become an inevitable trend in industry development. The establishment of this award aims to set an example for Chinese semiconductor enterprises, encourage more enterprises to actively explore international markets, seek and seize overseas business opportunities, and promote the internationalization process of China's semiconductor industry.

[Application Conditions]

1. Overseas market accounts for no less than 10% of the company's revenue, or the company has overseas sales centers, factories, etc.;

2. There is brand reporting and promotion overseas, and supporting materials of reporting and promotion within the past 2 years must be provided; [Evaluation Criteria]

1. Overseas layout and revenue scale (50%) Overseas revenue accounts for ≥10% of the enterprise's total revenue, or overseas sales centers, production bases, and other physical institutions have been established, with corresponding supporting materials available.

2. Overseas brand communication (30%) Overseas brand promotion and marketing have been carried out in the past 2 years, with complete overseas media reports and market promotion supporting documents, and remarkable overseas brand exposure results.

3. Overseas development potential (20%) Stable overseas customer channels, continuous growth of overseas business, clear overseas market expansion plans, and long-term international operation capability.