MediaTek Hires Former Intel Executive Shahriari, Pursuing Dual-Track Packaging with CoWoS and EMIB
TrendForce reports that former Intel Executive Vice President Naveed Shahriari will join MediaTek on November 9 as Senior Vice President, reporting directly to the President and Chief Operating Officer, overseeing advanced process and yield platforms, design-technology co-optimization, advanced testing and packaging, and related areas. MediaTek is collaborating with Intel on EMIB technology for some cloud ASIC projects while also supporting TSMC's CoWoS, forming a dual-track packaging strategy. Its first AI accelerator ASIC began shipping in September 2026, is expected to generate approximately $2.5 billion in revenue in the fourth quarter, and targets approximately $16 billion in AI ASIC revenue and about 20% market share in 2027.
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Examining how MediaTek, through the recruitment of a former Intel executive, is using advanced packaging as a lever to enter the AI ASIC market, along with its revenue and market share targets.
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On November 6, TrendForce published a blog post today (November 6) reporting that former Intel executive Navid Shahriari will join MediaTek on November 9 as Senior Vice President, reporting directly to the company's President and Chief Operating Officer.
Citing the blog post, Shahriari has 37 years of experience in semiconductor design engineering and advanced packaging, and has long been deeply engaged in the data center market. After joining MediaTek, he will oversee key areas including advanced process and yield platforms, design technology co-optimization, advanced testing and packaging, and quality and reliability.
Shahriari spent many years at Intel, where he served as Executive Vice President, responsible for packaging and testing, foundry technology and manufacturing operations, and led complex packaging, substrate technology, and production support for large global manufacturing sites. His experience covers embedded chip packaging, test and validation, data center product portfolios, and IP and ecosystem development related to CPU and GPU/NPU.
On the market side, MediaTek is reportedly collaborating with Intel on EMIB (Embedded Multi-die Interconnect Bridge) technology for some cloud ASIC projects, which may include work related to Google TPU. At the same time, MediaTek also supports TSMC's CoWoS technology, forming a "CoWoS+EMIB" dual-route packaging strategy that allows customers to choose solutions according to their needs.
The institution interprets this as AI ASIC becoming MediaTek's new growth engine. The company's first AI accelerator ASIC began shipping in September 2026 and is expected to generate about US$2.5 billion (Note: approximately RMB 16.714 billion at current exchange rates) in revenue in the fourth quarter; MediaTek also aims to achieve about US$16 billion (approximately RMB 106.967 billion at current exchange rates) in AI ASIC revenue and about a 20% market share in 2027, with next-generation products planned for mass production in the first quarter of 2028.
TrendForce believes this is not the first time MediaTek has brought in a heavyweight talent from the packaging field. In May 2026, MediaTek hired former TSMC R&D Vice President Douglas Yu as a part-time consultant to assist with advanced packaging R&D and roadmap planning. These two personnel moves show that MediaTek is treating advanced packaging as an important pillar for entering the AI ASIC market.