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Electronic Technology ApplicationUpdated Oct 24 23:21

Infineon to Showcase at electronica 2026: Demonstrating Robotics, Smart Mobility and AI Data Center Solutions

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At electronica 2026, taking place from November 10 to 13, Infineon will showcase physical AI customer cases and system solutions under three major themes: robotics, smart mobility and AI data centers, at Booth 502 in Hall C3. In robotics, it will demonstrate system-level solutions that coordinate perception, computing, connectivity and motor control, including an out-of-the-box solution that simulates a human hand. In automotive, it will present AI-enhanced battery management, an X-in-1 integrated powertrain and a next-generation automotive microcontroller platform based on RISC-V.

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[Munich, Germany, October 22, 2026] As artificial intelligence moves from virtual chatbots into real-world machines and devices, it will profoundly shape people's lives in unprecedented ways. At electronica 2026, to be held November 10–13, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a global semiconductor leader in power systems and IoT, will showcase Physical AI customer cases, system solutions and semiconductor innovations in areas including robotics and mobility, smart edge devices, and the infrastructure required for the AI era. Infineon's technologies help machines perceive their environment, communicate securely, process data locally using edge AI, and execute commands safely and reliably while using energy as efficiently as possible. Infineon's booth is located in Hall C3, Stand 502.

"Many machines of the future will be able to perceive, think and act autonomously in real time, bringing unprecedented opportunities in areas ranging from everyday convenience, healthcare and mobility to energy efficiency and economic productivity," said Andreas Urschitz, Chief Marketing Officer of Infineon Technologies. "As AI extends from the cloud to the edge and becomes increasingly integrated into the physical world, semiconductor innovation is becoming the key foundation for deploying intelligent technologies efficiently and turning them into dependable real-world actions. At this year's electronica, we will show how Infineon is working with customers and partners to build the technology foundation for the AI era."

Andreas Urschitz, Member of the Management Board and Chief Marketing Officer of Infineon Technologies

Infineon will present its innovations under the following three themes:

Robotics is the most complex form of Physical AI, with applications spanning production floors, the service sector and the home. Infineon's semiconductors support every functional block of a robot, covering sensing, computing, connectivity, motor control and power. These components work together to turn perception into precise motion, while functional safety and cybersecurity mechanisms embedded at the hardware level provide a solid foundation of trust for even the most advanced robots.

At electronica, visitors to the Infineon booth will be able to watch live robot demonstrations and experience firsthand how Physical AI performs in a real production environment. In addition, Infineon will showcase several system-level robotics solutions, including an out-of-the-box solution that emulates the most dexterous part of the human body — the hand — achieving the required precision and efficiency. The Infineon booth will also provide an in-depth look at how edge intelligence empowers a new generation of devices, from industrial automation to smart home security and everyday appliances. Exhibits will also highlight how Infineon helps enhance the security of smart connected devices, enabling them to withstand evolving cybersecurity risks in the quantum computing era.

Enabling the future of mobility with software-defined electric vehicles

In modern cars, AI is increasingly permeating every aspect of the vehicle. AI interprets sensor data in driver assistance and automated driving functions, helps improve range and extend battery life, and is expected to become part of control loops — for example, cars will be able to adjust vehicle dynamics in real time based on road conditions and energy consumption. In addition, in the software-defined era, vehicles can continuously evolve through cloud connectivity: after a vehicle leaves the factory, new software can continue to be delivered from the cloud, continuously improving existing functions through software and gaining new features and services.

During electronica, Infineon will show how its semiconductor and system innovations support this transformation, turning software and AI capabilities into stable and reliable vehicle behavior. Attendees can gain insight into the core technologies of the centralized automotive architecture underpinning this change and learn about their practical application in a premium vehicle model. They will see system-level innovations enabled by Infineon, such as AI-enhanced battery management, X-in-1 integrated powertrain solutions, and next-generation automotive Ethernet connectivity technologies that provide functional safety and cybersecurity for high-speed communication between vehicle systems. Visitors will also get a first look at Infineon's next-generation automotive microcontroller platform. The platform will leverage the advantages of the open RISC-V standard to bring higher levels of intelligence, scalability, functional safety and cybersecurity to software-defined vehicles and other Physical AI systems.

AI is driving a large-scale expansion of digital infrastructure, creating unprecedented demand for computing power and electricity. Meeting this demand sustainably requires building intelligent power systems spanning from renewable energy and the grid to the processor cores of AI servers, enabling efficient energy generation, conversion, distribution and management.

At electronica, Infineon will show how its semiconductor innovations build this underlying foundation. Visitors can learn about technologies that improve energy efficiency across the entire power supply chain. These technologies enable AI data centers to deliver greater computing performance while reducing energy consumption. Solutions that optimize power transmission from the grid to advanced AI processors will also be on display, along with next-generation solid-state power distribution technologies, and an explanation of how renewable energy and grid-forming battery energy storage systems can ensure future grid stability and enhance grid resilience. By combining power, control, sensing, connectivity and security technologies, Infineon helps connect the worlds of energy and intelligence to power the future.

Infineon booth information

electronica 2026 will be held November 10–13 in Munich, Germany. Infineon's booth is located in Hall C3, Stand 502.

Source

Electronic Technology Application