Intel Exhibits at the 9th China International Import Expo, Showcasing Intel 18A Full-Stack Computing and Green Power Energy Storage Computing Solutions

Zhidongxi reported on November 5 that today, the 9th China International Import Expo opened in Shanghai. Intel, together with ecosystem partners, showcased at the Technical Equipment exhibition area computing products covering data centers, network edge and intelligent terminals, an integrated green power energy storage and computing power solution, a token all-in-one machine, as well as agent PCs and gaming terminals, demonstrating the collaborative achievements of Intel and its partners in promoting the implementation of intelligent applications and exploring green computing power construction.

"In the agent era, advances in computing power need to be combined with industry demands, energy efficiency and business sustainability in order to be transformed into lasting productivity. The CIIE is not only a window for showcasing new technologies and new applications, but also an important platform for connecting the needs of different markets and deepening long-term cooperation," said Wang Zhicong, Chairman of Intel China. "Intel will leverage its advantages in global products and open platforms, deepen collaboration with Chinese industry partners, promote better service of global technologies to local applications, and also enable customized innovative products based on local needs to benefit both the Chinese and global markets."

On the morning of November 6, Intel Vice President Sarah Kemp will be invited to attend the sub-forum of the 9th Hongqiao International Economic Forum themed "Corporate Strength in a Changing Landscape: Building More Sustainable Industrial Partnerships" to discuss with all parties the long-term value of industrial partnerships.

I. Showcasing computing products for diverse needs, accelerating end-edge-cloud collaboration in the agent era

As agent applications place higher demands on system collaboration and logical scheduling, the key role of the CPU is further strengthened, and deep end-edge-cloud collaboration has also become a core path to reducing costs and increasing efficiency. Around this trend, Intel demonstrated multi-level computing capabilities from underlying chips to system deployment.

Relying on its core Intel 18A advanced process and packaging capabilities, Intel translates advanced processes into computing products for diverse needs.

Its booth centrally showcased the full-stack computing matrix of the 3rd Gen Intel Core Ultra processors, Intel Xeon 6+ processors and the new generation of network and edge (NEX) products, covering diverse application needs across clients, edge and data centers, and providing a high-efficiency foundation for end-edge-cloud collaboration.

The 3rd Gen Intel Core Ultra processor (codenamed Panther Lake) is the first computing platform built on the Intel 18A process node, targeting multiple form factors such as laptops, gaming handhelds, robots and industrial edge devices. The product will be officially launched in January 2026.

The 3rd Gen Intel Core processor (codenamed Wildcat Lake) is built on the Intel 18A process node, adopts a new generation of CPU cores and integrates Xe3 architecture graphics capabilities.

In the data center and enterprise application fields, Intel Xeon 6+ processors balance performance and energy consumption with a high-density architecture, meeting the high-concurrency scheduling needs of agents.

Intel Xeon 6+ processors (codenamed Clearwater Forest) are the first data center CPUs built on the Intel 18A process, equipped with up to 288 efficiency cores and 576MB L3 cache. A single processor can stably support more than 1,000 agents, targeting cloud-native, agentic AI and network-intensive workloads.

The token all-in-one machine integrates high-density computing power with full-stack software into a system that can be flexibly deployed and is ready to use out of the box. One token all-in-one machine is a department-level AI factory. It can greatly reduce noise with advanced liquid cooling technology, simplify installation and daily operation and maintenance through a highly modular design, and can be directly deployed in offices without relying on professional computer rooms. A single machine can run flagship large models with trillion-level parameters and execute AI tasks in multiple scenarios such as AI inference, AI Coding and digital employees.

In the intelligent terminal field, on-device AI is moving from "waiting for instructions" to "proactive service." Relying on CPU, GPU and NPU computing engines and a hybrid deployment method of device-cloud collaboration, Intel, together with ecosystem partners, introduced agent applications and systems such as Baidu Dazi, Doubao Work, Marvis and WorkBuddy into PCs, allowing agents to be deeply integrated into workflows such as office and learning, creative design, entertainment and life, and computer settings.

Intel's integrated green power energy storage and computing power solution adopts a standardized, modular container design and supports flexible configuration of computing power and energy storage modules according to customer needs.

This solution takes the Intel architecture CPU computing power platform as its core, combines full-stack technical capabilities to build a computing power cabin, and through cooperation with China's leading energy storage and power companies, combined with the capabilities of Chinese IT industry partners in equipment design and manufacturing, open-source AI ecosystems and computing power optimization, creates a new type of AI infrastructure with coordinated computing power and energy storage.

Relying on the containerized design, this solution can be deployed close to available green power resources, using green power to support AI inference and token generation and improving the matching efficiency of power and computing power resources; it can also be deployed close to computing power demand-side users, providing high-performance, low-latency intelligent computing capabilities.

Its standardized, modular design helps shorten deployment and delivery cycles, supports customers in building in phases and expanding capacity as needed according to actual business needs, and reduces the risk of mismatch between one-time large-scale construction and actual computing power demand.

The entire set of equipment can be customized in the factory, with a cycle of about 8-12 weeks; after the equipment arrives on site, it can be put into operation within as fast as one week, and supports overall relocation.

A single containerized computing power cabin in its solution can accommodate 12 standard racks and supports the deployment of computing power infrastructure with power consumption ranging from 100 kilowatts (kW) to several megawatts (MW). The entire set of equipment can be customized in the factory, with a cycle of about 8-12 weeks; after the equipment arrives on site, it can be put into operation within as fast as one week, and supports overall relocation and phased modular capacity expansion.

Conclusion: Operating in China for 41 years, building an open ecosystem with more than 15,000 partners

Intel believes that sustainable industrial partnerships are built on complementary strengths, mutual learning and continuous solving of practical problems. The value of an open platform lies not only in supporting specific applications, but also in enabling the expertise of different partners to connect effectively and gradually transforming project cooperation into jointly developed technology and ecosystem capabilities.

Intel combines its own accumulation in computing platforms, software-hardware collaboration and the global ecosystem with Chinese customers' and partners' understanding of local needs and industry experience, improving application efficiency and deployment flexibility in pragmatic collaboration, and enabling partner growth and corporate development to reinforce each other.

Over the 41 years of operating in China, Intel has always been rooted in the Chinese market and developed together with the local industry. At present, relying on a broad local business network, Intel has built an open ecosystem with more than 15,000 partners.

Facing the agent era, Intel plans to use efficient computing platforms to support partners in creating products and solutions that fit actual needs, and to practice "intelligent computing for efficiency, walking together in green" in industrial cooperation.