Ceva 2026 Edge Technology Seminar will be held on November 5 in Zhangjiang, Shanghai
Ceva announced that the 2026 Ceva Edge Technology Seminar will be held on November 5 at the Hilton Hotel in Zhangjiang, Shanghai, targeting semiconductor engineers, SoC architects, and embedded developers. The event is divided into two tracks: AI and Sensing, and Connectivity Technology. Topics cover the memory and bandwidth bottlenecks of LLM inference, NPU architectures for generative and multimodal AI, AI applications below 1TOPS, as well as Bluetooth 7, Wi-Fi 7/8, UWB, and 5G NTN custom chips.
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Ceva, Inc. (NASDAQ: CEVA), a leading licensor of smart edge chip and software IP, announced that the 2026 Ceva Edge Technology Seminar will be held on November 5 at the Hilton Shanghai Zhangjiang. The event invites semiconductor engineers, SoC architects, and embedded developers to jointly explore the key technologies and design decisions shaping the next generation of smart edge devices.
As AI continues to expand into all kinds of everyday products and autonomous systems, engineers need to integrate processing, sensing, and connectivity under stringent power, memory, and cost budget constraints. The seminar will delve into these challenges, with rich content including technical talks, industry perspective sharing, and partner solution demonstrations.
The day's event embodies Ceva's "connect, sense, and infer" philosophy: enabling devices to exchange information, understand their surroundings, and use AI to decide how to respond. These capabilities complement one another and together lay the foundation for physical AI and autonomous, context-aware products.
Attendees at the seminar will be divided into two groups to explore different technology topics:
• AI and sensing: application trends in physical AI; memory and bandwidth bottlenecks in large language model (LLM) inference; NPU architectures for generative AI and multimodal AI; opportunities for AI applications below 1 TOPS; partner solutions; and inertial sensing technology covering application scenarios ranging from robots to earbuds.
• Connectivity technology: Bluetooth 7 and related wireless subsystems; Wi-Fi 7 and Wi-Fi 8; ultra-wideband (UWB) and the IEEE 802.15.4ab standard; and custom chips for 5G non-terrestrial networks (NTN), satellite links, and drone communications.
Speakers include: Dr. Zhou Zhengyu, Chairman and CEO of Actions; Yang Yi, CEO of ACTT; Thomas Wu, CEO of Sirius Wireless; Markus Pettersson, Lab Head at LG Electronics; and Xiao Chen from BDsound.
• Location: Hilton Shanghai Zhangjiang, 1398 Haike Road, Pudong New Area, Shanghai
• Event time: 10:00–17:30