Understand this story
The US Federal Communications Commission (FCC) exercised a new power for the first time on October 22 local time, blocking two end products equipped with HiSilicon Hi3516CV610 chips from entering the US market, namely a dashcam and a wireless video transmitter. The new rules, which took effect on October 13, allow the FCC to deny device certification solely because a device internally uses components with logic processing capabilities produced by a listed company, even when the device manufacturer is not on the controlled list. The report also mentioned that the FCC proposed that applicants may in the future be required to submit a hardware bill of materials (HBOM) and a software bill of materials (SBOM), and that the US Semiconductor Industry Association has expressed opposition to this. There are currently no subsequent developments.
AI-generated from public reports
Latest development · Report
US FCC Invokes New Rules for the First Time, Banning Two Devices Equipped with HiSilicon Hi3516CV610 ChipsDevelopments
1 confirmed developments
- Source:English text is being prepared.
Reports and discussion timeline
Browse reports and discussion by time. Their evidence levels remain distinct.
Oct 26
Electronic Technology Application
US FCC Invokes New Rules for the First Time, Banning Two Devices Equipped with HiSilicon Hi3516CV610 Chips
The US Federal Communications Commission (FCC) on October 22 local time exercised for the first time the new authority that took effect on October 13, blocking two end products equipped with HiSilicon Hi3516CV610 from the US market on the grounds that they contain "foreign surveillance chips"—a dashcam and a wireless video transmitter, respectively. The new rules allow the FCC to deny device certification solely because a device internally uses components with logic-processing capabilities produced by a listed company, even when the finished-product manufacturer is not on the restricted list. The FCC has also proposed that applicants may in the future be required to submit a hardware bill of materials (HBOM) and a software bill of materials (SBOM), which the US Semiconductor Industry Association has opposed.