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According to sources, Tesla and Nvidia plan to invest a combined total of about 3 trillion won in Samsung Electro-Mechanics, earmarked for expanding AI semiconductor packaging substrate FC-BGA capacity, with Tesla contributing about 1 trillion won and Nvidia about 2 trillion won. The report says Tesla's dedicated line will be located at the Sejong plant, producing AI semiconductor substrates for autonomous-driving electric vehicles and the humanoid robot Optimus, with a supply contract period from 2029 to 2033; Nvidia's dedicated line targets data centers, producing AI computing chipsets and network substrates, and the related cooperation was disclosed on October 21 at GTC 2026 in Germany. Samsung Electro-Mechanics had just announced on September 28 a combined 6.78 trillion won packaging substrate capacity expansion plan, with mass production targeted for September 2028. The investment news still comes from sources and has no official confirmation.
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Tesla and NVIDIA plan to invest 3 trillion KRW in Samsung Electro-Mechanics to expand FC-BGA capacityDevelopments
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Report: Tesla and Nvidia plan to invest about 3 trillion won in Samsung Electro-Mechanics
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Oct 23
Semiconductor Industry Observer
Tesla and NVIDIA plan to invest 3 trillion KRW in Samsung Electro-Mechanics to expand FC-BGA capacity
According to sources, Tesla and NVIDIA plan to jointly invest approximately 3 trillion KRW in Samsung Electro-Mechanics, earmarked for expanding FC-BGA capacity for AI semiconductor packaging substrates, with Tesla contributing approximately 1 trillion KRW and NVIDIA approximately 2 trillion KRW. Tesla's dedicated line will be located at the Sejong plant, producing AI semiconductor substrates for autonomous driving electric vehicles and the humanoid robot Optimus, with a supply contract period from 2029 to 2033; NVIDIA's dedicated line targets data centers, producing AI computing chipsets and network substrates, with the collaboration disclosed on October 21 at GTC 2026 in Germany. Samsung Electro-Mechanics had just announced on September 28 a packaging substrate capacity expansion plan totaling 6.78 trillion KRW, with mass production targeted for September 2028.