Former Intel packaging head Navid Shahriari joins MediaTek as Senior Vice President
Navid Shahriari, former Executive Vice President of Packaging and Testing, Foundry Technology and Manufacturing Operations at Intel, will join MediaTek on November 9 as Senior Vice President, reporting to the General Manager and Chief Operating Officer, and will be responsible for teams including advanced process and yield platforms, design-technology co-optimization, and advanced testing and packaging. He has more than 37 years of experience in semiconductor design and advanced packaging, and one of his priorities after taking office will be deepening MediaTek's cooperation with supply chain partners such as TSMC. MediaTek is advancing a dual-track packaging route of TSMC CoWoS and Intel EMIB, and some cloud computing ASIC projects have already adopted EMIB.
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MediaTek announced that Navid Shahriari will join the company on November 9 as Senior Vice President, reporting to the company's General Manager and Chief Operating Officer.
Shahriari has more than 37 years of experience in semiconductor design engineering and advanced packaging, including extensive hands-on experience in the data center market.
The appointment is part of MediaTek's strategic expansion into data centers and AI computing. After joining MediaTek, Shahriari will be responsible for leading the relevant teams, covering areas including advanced process and yield platforms, design-technology co-optimization, advanced testing and packaging, and quality and reliability.
Shahriari spent most of his career at Intel. Previously, he served as Executive Vice President of Intel's Packaging and Testing, Foundry Technology, and Manufacturing operations. Intel announced in June 2026 that Shahriari would retire after 37 years with the company.
During his tenure at Intel, he managed large technical teams, drove the development of some of the industry's most complex packaging and substrate technologies, and supported product launches at multiple large-scale manufacturing sites worldwide. His responsibilities covered packaging assembly, embedded die packaging, substrates, testing and validation, the data center product portfolio, CPU cores and GPU/NPU intellectual property, ecosystem enablement, and silicon technology and packaging technology development, among others.
Shahriari holds a bachelor's degree in manufacturing engineering and a master's degree in technology from Arizona State University, holds two patents, and has delivered numerous keynote speeches in the semiconductor industry.
MediaTek said that one of Shahriari's key priorities after taking office will be to further deepen cooperation with TSMC and other important supply chain partners. The company believes that his experience in manufacturing will help MediaTek and its partners integrate advanced technologies more closely and enhance the competitiveness of AI and high-performance computing products.
This personnel change comes as MediaTek's advanced packaging partnerships are also expanding. It was previously reported that MediaTek has collaborated with Intel on some cloud computing ASIC projects using EMIB advanced packaging technology, including work related to the Google TPU project.
Meanwhile, MediaTek is reportedly advancing both the TSMC CoWoS and Intel EMIB packaging routes. As demand for AI chips continues to grow, this "dual-track" strategy helps diversify packaging capacity and reduce dependence on a single supplier.