Beijing Dabo's semiconductor bonding materials base settles in Changzhou; Luanqi Technology completes B+ round financing; SmartSens' Xu Chen receives TEEC Entrepreneurship Achievement Award; Dianbo Weixun's glass-based RF chips enter mass production

1. Beijing Dabo signs to settle in Changzhou, will build a smart manufacturing base for semiconductor bonding materials;

2. Luanqi Technology completes B+ round of financing, focusing on R&D of storage product testing equipment;

3. Dr. Xu Chen, Chairman of SmartSens, wins the 2025 TEEC Entrepreneurship Achievement Award;

4. [IC Fengyun List Candidate Enterprise 11] Dianbo Weixun: Glass-based RF chips achieve global large-scale mass production

1. Beijing Dabo signs to settle in Changzhou, will build a smart manufacturing base for semiconductor bonding materials;

On October 20, Beijing Dabo Nonferrous Metal Welding Material Co., Ltd., a state-owned enterprise under Beijing Yiqing Holding, officially signed a contract with the Management Committee of Changzhou West Taihu Science and Technology Industrial Park to build a smart manufacturing base project for semiconductor bonding materials in West Taihu.

According to "West Taihu" news, Beijing Dabo is a national-level specialized, refined, distinctive and innovative "little giant" and industry leader in the field of domestic semiconductor electronic interconnection materials. It is also the lead drafting unit of the national standard for gold bonding wire and one of China's top ten semiconductor materials enterprises. Having deeply cultivated the industry for more than 20 years, it has long undertaken major research tasks such as the national "02 Special Project," broken the monopoly of overseas giants such as Heraeus and Tanaka Precious Metals, and achieved domestic substitution of high-end bonding materials. Its comprehensive production capacity, technical strength and market share rank first among domestic enterprises and seventh globally. Its products have long supplied leading domestic packaging and testing enterprises such as Tongfu Microelectronics, JCET and Tianshui Huatian, and have entered the automotive-grade and memory packaging supply chains. After the project lands, it will form a key "material—memory" collaborative node with the West Taihu (Changzhou) Advanced Memory Industrial Park: through localized smart manufacturing of high-end bonding materials, it will strengthen the supply chain shortcomings in the packaging and interconnection links of advanced memory chips, and inject upstream core material support into West Taihu's effort to build a "leading memory integrated manufacturing highland in the Yangtze River Delta."

It is reported that West Taihu, as the core carrying area of Changzhou's advanced memory industry, is building a full-chain ecosystem around the three major directions of "advanced memory, new memory and future memory," anchoring five major sub-tracks: industrial-grade memory, automotive-grade memory, new memory, AIoT memory and memory modules/systems, and striving to build a domestically leading demonstration base for AI memory R&D, pilot testing, module manufacturing and application within 3–5 years.

Bonding wire is the "nerve wire" between chips and external circuits, directly determining signal integrity and long-term reliability in memory chip packaging.

According to the introduction, Beijing Dabo's full-spectrum bonding wire products—gold wire, palladium-coated copper wire, alloy wire, aluminum wire and silver wire—are precisely the key consumables covering consumer-grade, automotive-grade and industrial-grade memory packaging, and can directly meet the packaging verification needs of West Taihu's automotive-grade memory and industrial-grade memory projects. On this basis, the project will also simultaneously lay out third-generation semiconductor high-temperature-resistant special bonding materials, and prospectively advance the frontier technology verification and pilot-scale implementation of graphene composite interconnection wires, building a three-tier product innovation system of "domestic substitution of mature products + iterative upgrading of incremental products + forward-looking reserve of frontier technologies."

2. Luanqi Technology completes B+ round of financing, focusing on R&D of storage product testing equipment

Recently, Luanqi Technology completed a B+ round of equity financing. This round was jointly invested by Yunze Capital and Fengyuan Capital, with Yunze Capital making its third consecutive investment in Luanqi Technology. The funds raised will be focused on R&D and iteration of high-end storage testing equipment, production line expansion, and layout of new product lines, while strengthening the construction of full-scenario testing solution capabilities for storage products, and further improving full-chain service capabilities from R&D testing and product introduction testing to mass production testing.

Luanqi Technology is a developer and seller of storage product testing equipment, focusing on the R&D and sales of storage product testing equipment and providing semiconductor storage testing services. It is committed to providing professional and comprehensive domestic testing equipment and solutions for semiconductor storage products, helping enterprises establish complete and clear testing standards.

3. Dr. Xu Chen, Chairman of SmartSens, wins the 2025 TEEC Entrepreneurship Achievement Award

Recently, the Tsinghua Entrepreneur and Executive Club (TEEC) 2026 Global Annual Meeting was grandly held in Shanghai. At the awards ceremony held concurrently, the winners of the TEEC 2025 Entrepreneurship Spirit Award, Entrepreneurship Achievement Award and Helping Others Award were officially announced. Dr. Xu Chen, founder, chairman and CEO of SmartSens, was honored with the "2025 TEEC Entrepreneurship Achievement Award." This award aims to commend outstanding entrepreneurs for their pioneering achievements, and recognizes Dr. Xu Chen for deeply cultivating the CMOS image sensor field with an entrepreneur's vision, adhering to independent technological innovation, leading the team to achieve a leap from frontier technology R&D to industrial implementation and large-scale development, and continuously empowering the independent and high-quality development of the domestic CMOS image sensor industry.

The Tsinghua Entrepreneur and Executive Club (TEEC) is a non-political, non-commercial, privately run organization specifically for Tsinghua alumni, mainly composed of entrepreneurs who value the technological content of enterprise value, and whose members may join only by special invitation. The "TEEC Entrepreneurship Achievement Award" is an authoritative recognition established by the association to commend entrepreneurs who have led their enterprises to achieve breakthrough development results in the past year.

Dr. Xu Chen graduated with a bachelor's degree from the Department of Electronic Engineering at Tsinghua University, where he built a foundation in electronic engineering on the Tsinghua campus, and later pursued in-depth research in imaging technology at the Hong Kong University of Science and Technology. With the original aspiration of industrial self-reliance, Dr. Xu Chen returned to China in 2011 to start a business and founded SmartSens, focusing for the long term on the technology R&D and industrialization of high-performance CMOS image sensors. As the first Chinese enterprise leader in the CIS field whose paper was selected for the International Solid-State Circuits Conference (ISSCC), Dr. Xu Chen holds a cumulative total of 136 CIS-related patents in China and abroad and has published more than 30 professional papers, 4 of which were selected for ISSCC, continuously achieving breakthroughs in frontier technology tracks.

Under Dr. Xu Chen's leadership, SmartSens has independently developed a number of core patented technologies and built a full series of high-performance CMOS image sensor products, providing high-performance CIS product solutions for fields such as intelligent security, smartphones, and automotive electronics, empowering the intelligent vision upgrade of industries across the board.

In 2022, SmartSens (688213.SH) successfully listed on the STAR Market of the Shanghai Stock Exchange, completing an important entrepreneurial milestone. After years of deep cultivation, the company's market position has continued to rise. According to the latest TSR report, in 2025 SmartSens ranked third globally in CIS shipments, among which security CIS shipments retained first place worldwide, while smartphone CIS and automotive CIS shipments both entered the global top three. With a series of outstanding entrepreneurial achievements ranging from technological breakthroughs and business operations to industrial empowerment, Dr. Xu Chen was selected for the 2025 Forbes China Best CEO list and was honored with the 2025 TEEC Entrepreneurship Achievement Award.

This award is both TEEC's high recognition of Dr. Xu Chen's long-term commitment to his original entrepreneurial aspiration and his persistence in technological innovation, and strong confirmation of his leadership of SmartSens in continuously pioneering and achieving breakthrough entrepreneurial results in the high-performance CIS field. Looking to the future, Dr. Xu Chen will continue to practice the spirit of his alma mater Tsinghua University's motto, "Self-discipline and Social Commitment," continue to deepen his work in the high-end CMOS image sensor field, promote the in-depth implementation of the "3+AI" development strategy, build an integrated collaborative capability of "high-precision perception—high-speed interconnection—intelligent computing," and inject Chinese "core" momentum driven by the deep integration of imaging and AI technologies into the global CIS market.

4. [IC Fengyun List Candidate Enterprise 11] Radio Micro Communication: Glass-based RF chips achieve global large-scale mass production

[Editor's Note] As an annual benchmark event in the semiconductor industry, the 8th IC Fengyun List is positioned at the critical window of industrial technology iteration and domestic substitution. This year's list has been fully upgraded, with 70 heavyweight awards covering eight core fields including AI, embodied intelligence, and smart vehicles, and multiple special awards newly added and optimized. The judging panel is composed of more than 100 semiconductor investment alliance units and 500+ industry CEOs. The list of winners will be announced at the 2027 Semiconductor Investment Annual Conference ceremony, with full efforts to identify industry benchmarks and set up industry innovation models.

[Candidate Enterprise] Radio Micro Communication (Ningbo) Communication Technology Co., Ltd. (abbreviated as "Radio Micro Communication")

[Candidate Award] Annual Technology Breakthrough Award

In the post-Moore era, with the rapid evolution of AI computing power, 6G, and low-orbit satellite communication industries, traditional communication chip and module solutions face a series of industrial pain points such as relatively large size, high high-frequency loss, insufficient temperature-drift reliability, and MLCC supply chain fluctuations. Glass substrates and TGV glass through-hole technology are regarded as core tracks of next-generation advanced packaging and system integration, and are accelerating from laboratory research toward industrialization. On this track, the startup Radio Micro Communication, relying on underlying technology breakthroughs and commercialization results, has formally entered the Annual Most Promising Growth Award.

Radio Micro Communication was founded in December 2024 and is a high-tech enterprise focused on the R&D and industrialization of glass-based chips. The company was founded by Dr. Xuan Kai, a senior expert in the communication chip field, and its core team has more than ten years of composite experience in communication chip R&D, large-scale mass production, and capital market operations. At its founding, the company anchored itself to the frontier direction of next-generation glass-based communication chips and devices, focusing on key technologies such as glass-based substrate devices, TGV through-hole processes, and substrate heterogeneous integration, with the goal of breaking through the performance bottlenecks of traditional substrate materials, connecting the complete technology chain of glass-based chips from materials and process development to product validation, filling the shortcomings of the domestic new substrate chip industry chain, and helping the computing power and communication chip industries achieve self-reliance and controllability.

Relying on its self-developed GlassRadio™ full-stack technology platform, Radio Micro Communication has become the world's first enterprise to achieve large-scale mass production of glass-based RF chips, launching its main products, the dBT5321A / dBT5521A RF chip modules, opening up a new technology route for RF front-ends.

Underlying architecture innovation: GlassRadio™ reconstructs the RF integration solution

Traditional RF front-ends use large numbers of discrete SMD resistor, capacitor, and inductor components and are highly dependent on MLCC multilayer ceramic capacitors. Radio Micro Communication innovatively adopts a glass-based TGV high-density integration solution, using glass substrates as the foundation and combining massive TGV glass through-holes with multilayer RDL interconnect technology to integrate the PA power amplifier, LNA low-noise amplifier, RF switch, and SAW filter all inside the module, reconstructing the RF chip architecture from the ground up.

The dBT5321A RF chip module measures only 2mm×2mm×0.55mm; its module area is only 45% of comparable traditional solutions and its thickness is 75% of comparable solutions, achieving extreme miniaturization and thinness in the RF front-end. In terms of performance, the dielectric loss of the glass substrate is far lower than that of traditional resin substrates, significantly reducing high-frequency signal attenuation; the coefficient of thermal expansion of glass matches that of silicon chips more closely, so RF performance drift is smaller under high- and low-temperature environments, greatly reducing the risk of device failure and making it suitable for various high-frequency communication scenarios.

GlassRadio™ is a fully self-developed technology platform covering the entire chain from chip design, TGV process, and packaging and testing to RF algorithms. The company has currently filed 26 core invention patents, including multiple PCT international patents, and has innovatively achieved "precise modeling" and "computation instead of tuning" for RF, greatly reducing the manual tuning costs of traditional RF products. The technical solution streamlines large numbers of surface-mount passive components, reduces the number of suppliers, and effectively avoids the risks of MLCC capacity tightness and price fluctuations, laying a solid foundation for sustained large-scale mass production and commercialization.

Multi-dimensional competitive barriers: balancing performance, reliability, and mass-production capability

Compared with traditional organic-substrate and discrete-device RF solutions, Radio Micro Communication has formed differentiated barriers across five major dimensions, demonstrating strong growth potential.

Miniaturization and integration advantage: greatly reducing PCB footprint and solving the pain point of numerous discrete components in traditional RF front-ends, making it suitable for space-constrained scenarios such as miniature video transmission, lightweight wearables, and small industrial terminals.

High-frequency RF performance advantage: low dielectric loss brings better high-frequency characteristics, with outstanding harmonic suppression and power performance, naturally suitable for 5G high-power user equipment (HPUE), 6G, and LEO satellite communication RF links.

High-reliability advantage: glass substrates offer excellent thermal stability and stronger temperature-drift control, with stability superior to traditional organic-substrate solutions under harsh conditions such as vibration and high/low temperatures, meeting the stringent application environments of industrial monitoring, automotive, and spaceborne systems.

Mass-production and commercialization advantage: the technical achievements are not laboratory samples and have already completed large-scale mass production. The one-stop module delivery model reduces end customers' need for peripheral passive components, shortens terminal product development cycles, and accelerates customers' product launches.

Domestic autonomy and controllability advantage: the RF front-end has long been a weak link in the communications chip field. This solution bypasses the bottlenecks of traditional passive components, provides a brand-new technical route for RF solutions in domestically produced wireless communication terminals, and helps make the industrial chain autonomous and controllable.

Broad growth track: building on current applications and positioning for the next-generation communications market

In terms of commercialization, the dBT5321A module is currently mainly deployed in the wireless video transmission and industrial remote monitoring markets; over the medium and long term, Radio Micro Communication will continue to expand into incremental markets such as 5G/6G terminals, LEO satellite communications, smart wearables, automotive RF, and small mobile communication terminals.

In terms of long-term positioning, Radio Micro Communication is not limited to glass-based RF front-end chips; it is also conducting R&D on high-performance chips for directions such as interposers for data center AI computing chips, high-density glass passive devices, and short-range high-bandwidth optical communications. The company is committed to building a leading domestic innovation platform for glass-based chips and passive devices and to continuously promoting the domestic adoption of glass-based chips.

As a rising enterprise in the sector, Radio Micro Communication demonstrates the growth momentum of a hard-core science and technology company through its underlying original technology, milestone achievement of being the first to mass-produce, clear commercialization path, and broad market space. Entering this year's "Most Promising Enterprise of the Year Award" is both an industry test of its technological innovation achievements, and the company also hopes to use the award participation as an opportunity to continue promoting the co-building of the glass-based chip industry ecosystem and to help the high-quality development of China's new-substrate chip industry chain.

[Award Application Entry]

The 2027 Semiconductor Investment Annual Conference and IC Top List Award Ceremony will be held in December 2026. Award applications have been launched, and collection and reporting on candidate enterprises/institutions is currently underway. Welcome to sign up and join this industry feast!

[Annual Technology Breakthrough Award]

For enterprises in a certain semiconductor sub-sector whose technology and products have made breakthroughs and are about to enter a period of rapid development, and which have received investment from well-known institutions; and for enterprises that have formed strong competitive advantages in a sub-sector and are developing rapidly. The award aims to recognize these emerging industry enterprises with growth potential, help investors and project owners better understand the market environment and industry trends, and promote enterprises' leapfrog development.

[Application Conditions]

1. In a certain semiconductor sub-sector, the enterprise's technology and products have made breakthroughs and are about to enter a period of rapid development, and it has received investment from well-known institutions; or it has formed strong competitive advantages in a sub-sector and is developing rapidly;

2. A startup enterprise with 2025 main business revenue of RMB 5 million to RMB 100 million.

[Evaluation Criteria]

1. Technical and product barriers (40%): deep cultivation in a semiconductor sub-sector, achieving breakthroughs in core technology and product innovation, and possessing exclusive technical advantages.

2. Market competition and growth rate (35%): outstanding competitive advantages in a sub-sector, rapid business expansion, and 2025 main business revenue of RMB 5 million to RMB 100 million.

3. Capital development momentum (25%): having received capital injection from well-known investment institutions, a mature business model, and the conditions for rapid scaling and leapfrog development.