TSMC Plans to Raise CoWoS Advanced Packaging Prices by 10%-20%, Nvidia and AMD Face Cost Pressure
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According to a report by Taiwan's Commercial Times citing supply chain sources, TSMC is considering raising prices for advanced packaging processes by 10% to 20%, with the core product being the CoWoS packaging technology used to integrate chips with HBM. The report says TSMC's monthly CoWoS capacity is expected to exceed 130,000 wafers in 2026 and further increase to more than 200,000 wafers in 2027. The price increase will directly push up production costs for major chip companies such as Nvidia and AMD, and Apple's hardware products may also come under pressure from the combined packaging and memory costs.
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The report provides the CoWoS price increase range and the capacity ramp-up timetable, which can be used to observe the cost transmission path in the AI chip supply chain.
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据中国台湾《工商時報》援引供应链消息人士报道，台积电正考虑将其先进封装工艺价格上调10%至20%。此举若落地，将直接推高英伟达、AMD等芯片大厂的生产成本，同时可能进一步拉升苹果iPhone及MacBook的终端售价——苹果产品此前已因内存芯片价格上涨承受一定压力。
CoWoS需求溢出，产能吃紧触发涨价
台积电此次拟上调价格的核心产品为CoWoS（Chip on Wafer on Substrate）封装技术。
该技术将芯片与高带宽内存（HBM）整合于单一封装体内，是当前高端AI加速芯片不可或缺的关键工艺。
《工商時報》报道称，在产能扩充方面，台积电正持续推进CoWoS产能爬坡：预计2026年月产能将突破13万片，并有望于2027年进一步提升至20万片以上。
成本压力沿供应链向下传导
作为全球最大晶圆代工厂，台积电的定价决策对整条半导体供应链具有显著影响。其主要客户除英伟达、AMD外，还涵盖博通、高通及联发科等芯片设计巨头。
封装成本上涨对英伟达影响尤为直接——英伟达旗下数据中心GPU高度依赖CoWoS封装技术，涨价将压缩其产品毛利率或倒逼下游客户承担更高采购成本。对苹果而言，若封装成本上行叠加此前已上涨的内存芯片价格，旗下硬件产品的成本压力或将进一步加剧。
除封装涨价消息外，SpaceX CEO埃隆·马斯克此前对新兴云服务（neocloud）板块发表看空言论，亦于本周一对多只云计算及AI相关股票形成打压。风险提示及免责条款
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