AUO lays out glass substrate metallization, RDL and interposer, targeting advanced packaging for AI chips
AUO Chairman Paul Peng said the company starts from glass processing technology and is laying out metallization, redistribution layer (RDL), through-holes and interposer, with the goal of becoming an important partner to packaging fabs rather than replacing existing manufacturers. As AI chips grow larger, existing PCB boards may struggle in the future to meet the needs of large or high-density chips, and glass substrates are seen as an important direction for next-generation advanced packaging. The relevant new technology platform is expected to reach a certain level of maturity in 2 to 3 years, at which point the company hopes to first achieve small-volume shipments.
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Panel giant AUO is accelerating its expansion into the semiconductor field. Chairman Paul Peng said the subsidiary is building its position around the key tools, components and services required for semiconductor processes, and the related business is growing rapidly; in advanced packaging, AUO's goal is to "become an important partner to packaging companies" rather than replace existing players.
Peng said AUO has experience with automotive satellite antennas in glass packaging, but currently does not have full IC packaging capability and has no plans to transform into a packaging company. The company hopes to leverage its accumulated expertise in glass materials and processes to collaborate with existing packaging players and become an important supplier.
He further explained that as AI chips grow larger, the requirements for the substrate beneath the chip rise accordingly, with metrics such as warpage and thermal resistance facing stricter constraints; existing PCB boards may struggle to meet the needs of large or high-density chips in the future, so glass substrates are therefore seen as an important direction for next-generation advanced packaging. Starting from glass processing technology, AUO is building positions in metallization, redistribution layers (RDL), through-holes and interposers. The related new technology platform is expected to reach a certain level of maturity in 2 to 3 years, and the company hopes to achieve small-volume shipments by then.
Looking at the existing semiconductor footprint, AUO Precision Materials has long invested in the tools and components required for semiconductor processes, with products including dummy substrates and rings, and its operating revenue now comes entirely from semiconductor-related business; subsidiaries such as AUO Envtech Sustainability also provide semiconductor-related services. Peng said some subsidiaries are growing rapidly, but measured against AUO Group's revenue scale of about NT$280 billion, the related businesses still need to expand in scale to account for a meaningful share. The company places more emphasis on whether these businesses are heading in the right industry direction and on their future growth rates.