Yizhu Technology completes 1 billion+ yuan financing to accelerate industrialization of general-purpose compute-in-memory
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Yizhu Technology, China's first AI high-computing-power chip company with a general-purpose compute-in-memory architecture (GP-IMC®), has completed 1 billion+ yuan in financing; the funds will be used for subsequent R&D investment, product iteration, and industrialization advancement. Yizhu Technology has been officially operating since 2022, adhering to the technical route of "general-purpose compute-in-memory + super-heterogeneous", laying out 3D DRAM compute-in-memory, with products compatible with mainstream ecosystems such as CUDA and PyTorch, providing computing power solutions with lower token costs for scenarios such as data centers and AI cloud computing.
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国内首家通用存算一体架构（GP-IMC®）AI大算力芯片公司亿铸科技完成10亿+元融资。随着AI算力需求持续增长，通用存算一体等新型算力架构受到资本市场和产业界关注，亿铸科技也在技术研发与产品产业化方面持续推进。
亿铸科技正式运营于2022年，持续聚焦通用存算一体技术研发，坚持“通用存算一体+超异构”技术路线，围绕3D DRAM存算一体等技术方向持续布局。公司产品具备大吞吐、高性价比、低功耗等特点，并兼容CUDA、PyTorch等主流生态，为数据中心、AI云计算等场景提供软件易用、Token成本更低的全新算力解决方案。
此次融资将为亿铸科技后续研发投入、产品迭代及产业化推进提供进一步支持。随着技术研发和产品落地持续推进，其通用存算一体技术路线及相关产品也将得到更充分的市场验证。在AI算力需求持续增长的背景下，围绕芯片架构、存储技术、软件生态及产品应用的持续创新，正在成为推动新型算力技术走向产业应用的重要因素。