Beken Corporation Competes for the IC Industry Awards Annual AI Market Breakthrough Award with Edge AI Chip BK7259

【Editor's Note】As an annual benchmark event in the semiconductor industry, the 8th IC Fengyun List is positioned at a critical window of industrial technology iteration and domestic substitution. This year's list has been fully upgraded, featuring 70 heavyweight awards covering eight core fields including AI, embodied intelligence, and smart vehicles, with multiple special awards newly added and optimized. The judging panel is composed of over 100 semiconductor investment alliance units and 500+ industry CEOs, and the winners will be announced at the 2027 Semiconductor Investment Annual Conference ceremony, striving to identify industry benchmarks and set up models of industry innovation.

【Candidate Enterprise】Beken Corporation (Shanghai) Co., Ltd. (hereinafter referred to as: Beken)

【Candidate Award】Annual AI Market Breakthrough Award

【Candidate Product】High-Performance Edge AI Chip BK7259

Beken Corporation (Shanghai) Co., Ltd. (Stock Code: 603068.SH), as a leading domestic IoT wireless transmission, wireless multimedia processor, and edge-side AI chip design enterprise, has been deeply engaged in the wireless communication chip field since its establishment in 2004 and has grown into an important chip force driving innovation in the global smart terminal industry.

Headquartered in Zhangjiang, Shanghai, Beken has subsidiaries and technical branches in Shenzhen, Beijing, Hangzhou, Qingdao, Hong Kong (China), South Korea, the United States, and Japan, with business spanning the globe, providing core technical support to numerous industry leaders such as Amazon, AT&T, LG, Samsung, Sony, Midea, Haier, Hisense, and Tuya. As a pioneer of Wi-Fi MCU technology, Beken has built a full-series Wi-Fi connectivity matrix ranging from ultimate power efficiency to top-tier performance, achieving deep coverage and technological leadership across all standards and all scenarios in the pure-connectivity MCU field; at the same time, with a real-time "perception-computation-action" architecture, it has created an AI voice and vision MCU platform integrating high integration and high energy efficiency, forming a complete technical capability from wireless connectivity to edge-side intelligence.

The sustained leadership in technical capability is inseparable from high-intensity R&D investment. R&D personnel account for more than 80% of Beken, continuously consolidating the foundation of independent innovation. The company has obtained qualifications such as Shanghai High-Tech Enterprise, Shanghai "Specialized, Refined, Distinctive and Innovative" SME, and Shanghai Municipal Enterprise Technology Center, and has won multiple honors including the Second Prize of Shanghai Science and Technology Progress Award, the Second Prize of Shanghai Pudong New Area Science and Technology Progress Award, the China Semiconductor Industry and Technology Award, the "China Core" Outstanding Technological Achievement Transformation Project Award, the China IC Design Company Achievement Award, the Top Ten Greater China IC Design Company Brands, the Top Ten Most Promising Chinese IC Design Companies, and the Manufacturing Single Champion Product, with its technical strength and industrial contributions widely recognized.

This time, Beken is competing for the "IC Fengyun List" Annual AI Market Breakthrough Award with its high-performance edge AI chip BK7259 and has become a candidate enterprise. The award aims to recognize outstanding cases that successfully commercialized AI technology in 2026, produced significant economic benefits in specific fields, and promoted the intelligent transformation of the industry.

As a highly integrated high-performance edge AI MCU, BK7259 not only possesses excellent wireless connectivity but also integrates HD video H.264 encoding and decoding, 3DNR ISP, 2.5D GPU, MIPI 2-Lane camera interface and MIPI 4-Lane display interface, advanced audio, precise motion control, and dedicated AI processing functions, eliminating communication latency between multiple chips while minimizing power consumption. The product adopts M52+M55 dual cores, paired with an ARM Ethos U65 NPU with 0.25T computing power, empowering real-time intelligent analysis on the edge side and providing strong support for multimodal physical AI and robots. The product won the AIoT Innovative Technology Product Award at the 2026 International AI+IoT Ecosystem Development Conference and the 2026 "IOTE Gold Award" Innovative Product Award.

In terms of key technologies and innovation points, BK7259 is the first to integrate the ARM Ethos-U65 microNPU into a Wi-Fi 6 MCU, achieving 0.25 TOPS edge-side AI computing power and providing super computing power and energy efficiency for edge intelligent applications; the unified memory architecture enables NPU, GPU, and CPU to compute in parallel without frame drops, supporting real-time target tracking and natural language processing; edge-side local 3D face recognition is completed in about 200ms, with biometric data never leaving the device, balancing privacy and security; deep sleep current is as low as 2µA, achieving a balance between AI computing power and low power consumption; and it supports multi-protocol convergence such as Wi-Fi 6 + Bluetooth + IEEE 802.15.4, adapting to the connectivity needs of diverse smart terminals.

In terms of intellectual property, Beken owns more than 100 authorized invention patents related to Wi-Fi and Bluetooth for this product, and its comprehensive patent reserves have built a solid technical barrier for continuous iterative R&D of the product. BK7259 can be widely used in fields such as smart home, AI companion robots, AI toys, AI health care and wearables, all-time IPC, and industrial IoT, accelerating customers' progress from prototype to mass production and helping a new generation of autonomous, secure, and reliable smart terminal products land quickly.

From the full-series Wi-Fi connectivity matrix to the AI voice and vision MCU platform, from the global customer service network to more than 100 authorized invention patents, Beken is, through the deep integration of wireless connectivity and edge AI, continuously driving IoT smart terminals to evolve toward higher integration, lower power consumption, and stronger computing power, providing solid chip support for the intelligent upgrade of the global smart terminal industry.

【Award Application Entry】

The 2027 Semiconductor Investment Annual Conference and IC Fengyun List Award Ceremony will be held in December 2026. Award applications have been launched, and collection and reporting of candidate enterprises/institutions are currently underway. Welcome to sign up and participate, and join us at the industry feast!

【Annual AI Market Breakthrough Award】

Aims to recognize outstanding cases that successfully commercialized AI technology in 2026, produced significant economic benefits in specific fields, and promoted the intelligent transformation of the industry.

【Application Conditions】

1. The AI solution has achieved large-scale application in vertical fields;

2. The project's annual revenue exceeds 30 million yuan or it serves more than 100 customers;