Huachen Xinguang Builds Semiconductor Laser Chips with Its Globally Unique WXP Process; Single-Mode 980nm Chip Competes in IC Rankings

[IC Trends List Candidate Enterprise 8] Backed by the world's only WXP process, Huachen Xinguang forges a "Chinese chip" for semiconductor laser chips

Source: Ai Jiwei #Huachen Xinguang# #Investment Annual Conference# #IC Trends List#

[Editor's Note] As an annual benchmark event in the semiconductor industry, the 8th IC Trends List stands at a critical window for industrial technology iteration and domestic substitution. This year's list has been fully upgraded, with 70 heavyweight awards covering eight core fields including AI, embodied intelligence, and smart vehicles, and multiple featured awards newly added and optimized. The judging panel consists of over 100 semiconductor investment alliance units and 500+ industry CEOs. The winners will be announced at the 2027 Semiconductor Investment Annual Conference ceremony, with full efforts to identify industry benchmarks and set up innovation models for the industry.

[Candidate Enterprise] Zhejiang Huachen Xinguang Technology Co., Ltd. (hereinafter referred to as: Huachen Xinguang)

[Candidate Award] Annual Technology Breakthrough Award

Zhejiang Huachen Xinguang Technology Co., Ltd. (abbreviated as "Huachen Xinguang"), as an IDM-model high-tech semiconductor enterprise engaged in the R&D and manufacturing of highly reliable semiconductor laser chips, devices, and modules, is injecting strong momentum into the autonomous and controllable development of domestic semiconductor laser chips with its globally leading WXP facet passivation technology.

Founded in September 2021, Huachen Xinguang has subsidiaries in Wuxi, Jiangsu; Quzhou, Zhejiang; and Wuhan, Hubei. Among them, the Wuxi base has a 5,000-square-meter full-process manufacturing base for 4/6-inch gallium arsenide and indium phosphide semiconductor laser chips, covering complete process steps such as epitaxial growth, lithography, etching, thin-film growth, thinning, facet coating, testing, aging, and chip failure analysis; Quzhou and Wuhan have 10,000-square-meter manufacturing bases for optical devices and laser modules. The company's main business is highly reliable semiconductor laser chips, devices, and modules, and its products are widely used in cutting-edge fields such as fiber-optic communications, data communications, satellite communications, LiDAR, intelligent manufacturing, and low-altitude obstacle clearing. It can provide customers with integrated IDM laser solutions across the entire industry chain, from chips and devices to modules and system integration.

Huachen Xinguang has gathered world-class R&D experts in the GaAs and InP fields, with R&D personnel accounting for about 41%. It has been awarded multiple qualifications, including National High-Tech Enterprise, Specialized and Sophisticated SME, GEI China Potential Unicorn Enterprise, Zhejiang Future Unicorn Enterprise TOP100, and Enterprise Technology Center, demonstrating strong growth potential and industry influence.

This time, Huachen Xinguang is competing for the "IC Trends List" Annual Technology Breakthrough Award with its single-mode 980nm pump laser chip. This award aims to recognize enterprises that have achieved original major innovations in cutting-edge technology fields, reached internationally advanced levels, and played a major role in promoting the autonomous, secure, and controllable development of China's integrated circuit industry chain.

Huachen Xinguang's single-mode 980nm pump laser chip adopts continuous-wave operation mode and has advantages such as high electro-optical conversion efficiency, narrow linewidth, and stable optical performance. It is a core device for pump sources, optical amplifiers, and industrial laser systems. This product adopts the original WXP process, precisely regulating the band structure and QWI morphology through doping within the quantum well, suppressing facet absorption and stabilizing wavelength control, increasing the catastrophic optical damage threshold by more than 500%. WXP technology is an internationally top-tier core facet passivation technology. Huachen Xinguang was the first to successfully achieve a technological breakthrough and the first to complete mass-production verification, filling a domestic gap. In terms of performance, the slope efficiency of the single-mode 980nm chip exceeds 1.0W/A, and the slope efficiency of the multimode 9xxnm chip exceeds 1.2W/A. The chip's reliability lifespan is 5-10 times longer than that of traditional processes. This product has obtained 22 authorized invention patents and 38 authorized utility model patents.

The single-mode 980nm chip is mainly used as a pump light source for erbium-doped fiber amplifiers (EDFA), and is applied in fields such as 800G/1.6T high-speed coherent optical modules, DWDM backbone transmission networks, long-distance interconnection in AI data centers, fiber sensing, and special fiber lasers. Its comprehensive performance has reached the internationally leading level.

Based on the field of highly reliable semiconductor laser chips, Huachen Xinguang is using its core WXP technology as the cornerstone to continuously promote the industrialization of technological achievements and contribute Chinese chip strength to global optical communications and laser applications.

[Award Application Entry]

The 2027 Semiconductor Investment Annual Conference and IC Trends List Award Ceremony will be held in December 2026. Award applications have been launched, and solicitation and candidate enterprise/institution reports are currently underway. Welcome to sign up and participate, and join the industry feast together!

[Annual Technology Breakthrough Award]

The "Annual Technology Breakthrough Award" aims to recognize enterprises that in 2026 carried out original major technological innovations in cutting-edge technology fields, reached internationally advanced/leading levels, may generate major economic and social benefits in the future, and play a major role in promoting the autonomous, secure, and controllable development of China's integrated circuit industry chain.

[Application Conditions]

1. Deeply engaged in a certain segmented field of semiconductors, and the new technologies or products released in 2026 have original major technological innovations and reach internationally advanced/leading levels;

2. The products have a wide range of applications, good market prospects, and play an important role in the development of the global and domestic semiconductor industries.

Source: Ai Jiwei #Huachen Xinguang# #Investment Annual Conference# #IC Trends List#

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Huachen Xinguang Builds Semiconductor Laser Chips with Its Globally Unique WXP Process; Single-Mode 980nm Chip Competes in IC Rankings

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