UMC Wins Major PIC Orders from Innolight and SILITH, Unit Price Seven Times That of Traditional CMOS Processes
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UMC has won major PIC orders from global optical module leader Innolight and SILITH, with initial total volume expected to reach 10,000 wafers, to be produced at its Singapore fab, at a unit price seven times that of traditional CMOS processes. In July, UMC and SILITH announced the completion of the first batch of 12-inch silicon photonics mass-production wafer deliveries at the Singapore fab, taking 18 months from development to mass production. UMC plans to expand silicon photonics capacity at its Singapore P4 fab, with a long-term PIC monthly capacity target of 18,000 wafers, expected to begin tool installation at the end of 2028 and reach full scale by 2030.
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UMC Wins Major PIC Orders from Innolight and SILITH; Readers Can Use This to Understand the Silicon Photonics Foundry Capacity Landscape and Unit Price Differences.
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联电光通讯重量级订单到手，拿下全球光模块龙头中际旭创，及腾讯创投注资的光引擎芯片业者赛丽光子集成电路（PIC）大单，初期总量上看1万片，将在新加坡厂生产，后续可望再加单。相关产品单价是传统CMOS制程七倍，增厚联电获利大幅跃升。
联电成为中国台湾晶圆代工厂当中，第一家有能力提供光通讯关键芯片兼具放量生产与成本优势的业者，但联电对特定客户及接单消息不予评论。
业界指出，PIC用于光、电信号转换，是高速光模块关键芯片，相较于台系厂商擅长的CMOS制程，PIC涉及光波导、调制器与光电整合，制程复杂、良率门槛高，全球具备量产能力的晶圆代工厂有限，目前主要由高塔半导体、格罗方德等业者提供相关平台。
随着光通讯朝800G、1.6T甚至3.2T规格迈进，对相关光通讯芯片需求呈现倍数增长，高塔、格罗方德产能已全被抢光。联电以成熟制程接单，凭借特殊制程及成本优势，让中际旭创、赛丽上门要产能，联电也跻身全球AI高速光互连关键供应链。
中际旭创是全球数据中心光收发模块龙头，深耕北美云服务供应商（CSP）及AI市场，积极拓展800G、1.6T高速光模块。赛丽主打硅光子PIC设计，通过新加坡SILITH布局国际市场，每通道100G、200G PIC累计出货逾800万颗，并与联电共同开发每通道400G技术。
联电7月和SILITH宣布，新加坡厂完成首批12吋硅光子量产晶圆交付，从开发到量产仅花18个月，并通过大型云客户验证。供应链人士直言，若以12吋PIC商用量产实绩、规模及成本优势衡量，联电在中国台湾晶圆代工厂中几乎没有对手，成为国际大厂积极上门的重要原因。
产能方面，联电已宣布扩充新加坡P4厂区硅光子产能，并启动南科P7、P8新厂规划，PIC长期月产能目标达1.8万片，预计2028年底起装机，2030年达完整规模。市场传出，大客户已提前洽谈后续产能配置。