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NTT, NTT Innovative Devices, Japan Semiconductor Corporation, Furukawa Electric and Shinko Electric Industries have announced the full launch of development work on mass-production technology for optoelectronic fusion devices. According to Semiconductor Industry Vertical and Horizontal reports, the project is led by NTT Innovative Devices and plans to build a pilot production line, with the goal of raising production efficiency to more than 10 times the original level, focusing on optical chiplets that highly densely integrate PICs and EICs, covering manufacturing, inspection, optical connection and packaging and assembly processes; NTT serves as an advisor to coordinate cooperation and promote supply chain development. The report also states that since fiscal year 2023, the five companies have been conducting research and development on optical chiplet packaging technology under the same NEDO project framework. No further progress has been disclosed at present.
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Oct 23
Semiconductor Industry Observer
NTT and four other Japanese companies jointly advance mass-production technology for optical interconnect optical chiplets
Five companies—NTT, NTT Innovative Devices, Japan Semiconductor, Furukawa Electric, and Shinko Electric Industries—have fully launched development of mass-production technology for optoelectronic fusion devices, planning to build a pilot production line with the goal of raising production efficiency to more than 10 times the original level. The project is led by NTT Innovative Devices and focuses on optical chiplets that densely integrate PICs and EICs, covering manufacturing, inspection, optical connection, and packaging/assembly. NTT serves as an advisor to coordinate cooperation and promote supply chain development; previously, since fiscal 2023, the five companies have conducted R&D on optical chiplet packaging technology under the same NEDO project framework.