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T-Head releases the new-generation Zhenwu V900 training-and-inference integrated AI chip. According to Jiwei.com, the chip was released on September 22 at the Hangzhou Yunqi Conference; single-chip performance reaches three times that of Zhenwu M890, can meet the training and inference needs of trillion-parameter large models, and is planned for mass production and sale in the first quarter of 2027. The report says Zhenwu V900 carries 216GB of memory, chip-to-chip interconnect bandwidth of 1200GB/s, natively supports FP8 and FP4 low-precision computing, and can form a thousand-card full-bandwidth high-speed interconnect super node with the self-developed ICN Switch interconnect chip. T-Head also for the first time announced its Yitian server CPU plan, with Yitian 720 and Yitian 730 to be launched in 2027. There are currently no subsequent development facts.
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