Ibiden decides to invest 1.28 trillion won to expand CPU package substrate production

Oct 30

1. 15:57

   Semiconductor Industry Observer

   Ibiden to invest 151 billion yen to expand AI server IC substrate capacity

   Japanese packaging substrate manufacturer Ibiden plans to invest 151 billion yen (approximately 6.4 billion yuan), expanding production capacity for high-performance IC packaging substrates for CPUs at Building 6 of its Gama plant in Gifu Prefecture. New equipment will be put into production in phases starting in fiscal 2029, but the scale of the added capacity was not disclosed. In the first half of fiscal 2026, Ibiden reported revenue of 262.546 billion yen and operating profit of 60.116 billion yen, up 34.3% and 84.6% year-on-year respectively, while electronics business revenue rose 52% year-on-year to 172.540 billion yen. The company also raised its full-year revenue forecast from 550 billion yen to 565 billion yen, and its operating profit forecast from 127 billion yen to 133 billion yen.

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2. 12:23

   The Elec

   Ibiden to invest 1.28 trillion won to expand CPU package substrate production

   Japanese semiconductor package substrate manufacturer Ibiden plans to invest 1.28 trillion won to expand production capacity for high-performance CPU package substrates used in AI servers, with new equipment to be phased into operation starting in fiscal year 2029. Ibiden expects demand for CPU substrates to continue rising as AI inference workloads grow and agentic AI becomes more widespread. In the first half of fiscal year 2026, its revenue was 262.546 billion yen and operating profit was 60.116 billion yen, up 34.3% and 84.6% year-on-year, respectively.

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