Molex showcases connectivity solutions at electronica China

On July 1, 2026, Molex showcased cutting-edge connectivity solutions for scalable AI infrastructure, automotive connectivity, embodied intelligence and robotics, and data center connectors at electronica China 2026. According to Application of Electronic Technique, its newly launched Impress co-packaged copper cable solution supports data transfer rates up to 224Gbps PAM-4 and above; the MX-DaSH modular connector is designed and manufactured by the Chengdu factory. The report also mentioned that the Chengdu base covers 400 mu with a building area of over 200,000 square meters, making it Molex's largest production base globally. There are currently no subsequent development facts.

AI-generated from public reports

1. Jul 1· 1 reports

   Molex showcases connectivity solutions at electronica China in Shanghai

   Source:English text is being prepared.