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Yizhu Technology announced the completion of 1 billion+ yuan in financing, with the funds to be used for subsequent R&D investment, product iteration, and industrialization advancement. The company adheres to the "general-purpose compute-in-memory + super-heterogeneous" technology route, building around a 3D DRAM compute-in-memory layout; its products are compatible with mainstream ecosystems such as CUDA and PyTorch, and it provides computing power solutions for data centers and AI cloud computing. Reports say its all-digital general-purpose compute-in-memory AI chip has completed tape-out, and commercial chip test results basically meet the preset design targets; its solution claims that compared with mainstream cloud GPUs it can achieve several times the performance improvement, about 1/5 the power consumption, and about 1/6 the cost, with comprehensive TCO for large-model inference reduced to as low as about 1/6. Currently no further progress after the financing has been disclosed.
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Yizhu Technology completes over 1 billion yuan financing, advancing 3D DRAM compute-in-memory chipsDevelopments
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Oct 23
Zhidx
Yizhu Technology completes over 1 billion yuan financing, advancing 3D DRAM compute-in-memory chips
Suzhou-based AI chip company Yizhu Technology announced the completion of over 1 billion yuan in financing, with funds to be used for R&D investment, product iteration, and industrialization. The company takes 3D DRAM as its core technology route and says its all-digital general-purpose compute-in-memory AI chip has completed tape-out, with commercial chip test results basically meeting preset design targets. Its solution claims several times the performance improvement over mainstream cloud GPUs, about 1/5 the power consumption and about 1/6 the cost, with comprehensive TCO for large-model inference reduced to as low as about 1/6.
Jiwei.com
Yizhu Technology completes 1 billion+ yuan financing to accelerate industrialization of general-purpose compute-in-memory
Yizhu Technology, China's first AI high-computing-power chip company with a general-purpose compute-in-memory architecture (GP-IMC®), has completed 1 billion+ yuan in financing; the funds will be used for subsequent R&D investment, product iteration, and industrialization advancement. Yizhu Technology has been officially operating since 2022, adhering to the technical route of "general-purpose compute-in-memory + super-heterogeneous", laying out 3D DRAM compute-in-memory, with products compatible with mainstream ecosystems such as CUDA and PyTorch, providing computing power solutions with lower token costs for scenarios such as data centers and AI cloud computing.
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Yizhu Technology completes 1 billion+ yuan financing, accelerating industrialization of general-purpose compute-in-memory
Yizhu Technology, China's first AI high-compute chip company with a general-purpose compute-in-memory architecture (GP-IMC®), has completed 1 billion+ yuan in financing. Yizhu Technology officially began operations in 2022 and adheres to the technical route of "general-purpose compute-in-memory + super-heterogeneous," building around 3D DRAM compute-in-memory. Its products are compatible with mainstream ecosystems such as CUDA and PyTorch, providing lower Token-cost computing solutions for data centers and AI cloud computing. This financing will be used for subsequent R&D investment, product iteration, and industrialization advancement.
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