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Yizhu Technology completes 1 billion+ yuan financing

3 reports1 discussions4 story updatesUpdated Oct 23 17:32

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Yizhu Technology announced the completion of 1 billion+ yuan in financing, with the funds to be used for subsequent R&D investment, product iteration, and industrialization advancement. The company adheres to the "general-purpose compute-in-memory + super-heterogeneous" technology route, building around a 3D DRAM compute-in-memory layout; its products are compatible with mainstream ecosystems such as CUDA and PyTorch, and it provides computing power solutions for data centers and AI cloud computing. Reports say its all-digital general-purpose compute-in-memory AI chip has completed tape-out, and commercial chip test results basically meet the preset design targets; its solution claims that compared with mainstream cloud GPUs it can achieve several times the performance improvement, about 1/5 the power consumption, and about 1/6 the cost, with comprehensive TCO for large-model inference reduced to as low as about 1/6. Currently no further progress after the financing has been disclosed.

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Yizhu Technology completes over 1 billion yuan financing, advancing 3D DRAM compute-in-memory chips

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  1. Yizhu Technology completes 1 billion+ yuan financing

    Source:Zhidx

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Oct 23

  1. Zhidx

    Yizhu Technology completes over 1 billion yuan financing, advancing 3D DRAM compute-in-memory chips

    Suzhou-based AI chip company Yizhu Technology announced the completion of over 1 billion yuan in financing, with funds to be used for R&D investment, product iteration, and industrialization. The company takes 3D DRAM as its core technology route and says its all-digital general-purpose compute-in-memory AI chip has completed tape-out, with commercial chip test results basically meeting preset design targets. Its solution claims several times the performance improvement over mainstream cloud GPUs, about 1/5 the power consumption and about 1/6 the cost, with comprehensive TCO for large-model inference reduced to as low as about 1/6.

  2. Jiwei.com

    Yizhu Technology completes 1 billion+ yuan financing to accelerate industrialization of general-purpose compute-in-memory

    Yizhu Technology, China's first AI high-computing-power chip company with a general-purpose compute-in-memory architecture (GP-IMC®), has completed 1 billion+ yuan in financing; the funds will be used for subsequent R&D investment, product iteration, and industrialization advancement. Yizhu Technology has been officially operating since 2022, adhering to the technical route of "general-purpose compute-in-memory + super-heterogeneous", laying out 3D DRAM compute-in-memory, with products compatible with mainstream ecosystems such as CUDA and PyTorch, providing computing power solutions with lower token costs for scenarios such as data centers and AI cloud computing.

  3. Jiwei.comRelated discussion

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    This post contributes to heat; it is not a formal report or confirmed fact.

  4. Leiphone

    Yizhu Technology completes 1 billion+ yuan financing, accelerating industrialization of general-purpose compute-in-memory

    Yizhu Technology, China's first AI high-compute chip company with a general-purpose compute-in-memory architecture (GP-IMC®), has completed 1 billion+ yuan in financing. Yizhu Technology officially began operations in 2022 and adheres to the technical route of "general-purpose compute-in-memory + super-heterogeneous," building around 3D DRAM compute-in-memory. Its products are compatible with mainstream ecosystems such as CUDA and PyTorch, providing lower Token-cost computing solutions for data centers and AI cloud computing. This financing will be used for subsequent R&D investment, product iteration, and industrialization advancement.

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