Understand this story
Jiangsu Xinde Semiconductor Technology Co., Ltd. has passed the listing hearing of the Hong Kong Stock Exchange. According to Jiwei.com, the company passed the hearing on October 21, and the net proceeds from the IPO are intended to be used for building production bases, establishing new production lines and purchasing equipment, and enhancing advanced packaging R&D capabilities, with a focus on advancing the LDFO, X-SiP, TXV and 2.5D/3D integration of the CAPiC platform. The report also disclosed its financial data: the company's revenue increased from 509.1 million yuan in 2023 to 1,012.2 million yuan in 2025, the loss for the year widened from 358.9 million yuan to 483.1 million yuan, and the gross loss margin improved from 38.4% to 18.0%. No subsequent progress has been disclosed so far.
AI-generated from public reports
Latest development · Report
Xinde Semiconductor passes HKEX hearing, plans to raise funds to expand advanced packaging capacityDevelopments
1 confirmed developments
- Source:Jiwei.com
Reports and discussion timeline
Browse reports and discussion by time. Their evidence levels remain distinct.
Oct 22
Jiwei.com
Xinde Semiconductor passes HKEX hearing, plans to raise funds to expand advanced packaging capacity
Jiangsu Xinde Semiconductor Technology Co., Ltd. passed the Hong Kong Stock Exchange hearing on October 21. The net proceeds from the IPO will be used to build production bases, establish new production lines and purchase equipment, and enhance advanced packaging R&D capabilities, with a focus on advancing the LDFO, X-SiP, TXV and 2.5D/3D integration of the CAPiC platform. The company's revenue increased from RMB 509.1 million in 2023 to RMB 1,012.2 million in 2025, while its loss for the year widened from RMB 358.9 million to RMB 483.1 million over the same period, and its gross loss margin improved from 38.4% to 18.0%.