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xMEMS Labs announced that the XMC-2400 and XMC-4800 μCooling solid-state micro-cooling chips have entered mass production. The two chips target different compact devices: the XMC-2400 is aimed at compact edge devices such as AI/XR glasses and personal SSDs, while the XMC-4800 targets smartphones, enterprise-grade SSDs, and low-power data center subsystems; their maximum airflow is 28 cm3/s and 48 cm3/s respectively, with power consumption of about 150 mW and 240 mW. xMEMS says customer testing achieved chip-level and system-level cooling of 10–25°C. The first commercial products featuring the XMC-2400 are expected to launch in early 2027. This news is currently reported by a single source, with no subsequent factual developments yet.
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xMEMS Solid-State Micro-Cooling Chips XMC-2400 and XMC-4800 Enter Mass ProductionDevelopments
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Oct 20
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xMEMS Solid-State Micro-Cooling Chips XMC-2400 and XMC-4800 Enter Mass Production
xMEMS Labs announced that the XMC-2400 and XMC-4800 µCooling solid-state micro-cooling chips have entered mass production, with the first commercial products featuring the XMC-2400 expected to launch in early 2027. The two chips target compact edge devices such as AI/XR glasses and personal SSDs, and smartphones, enterprise SSDs, and low-power data center subsystems, respectively, with airflow of up to 28 cm³/s and 48 cm³/s and power consumption of approximately 150 mW and 240 mW. xMEMS says customer testing achieved chip-level and system-level temperature reductions of 10–25°C.