NVIDIA announces expansion of AI infrastructure capacity with supply chain partners

The Elec

Nvidia prepays six suppliers including Samsung Electro-Mechanics and Ibiden to expand production, locking in AI infrastructure capacity

On October 21, Nvidia announced partnerships with Samsung Electro-Mechanics, Ibiden, Amkor, KYEC, SPIL, and Unimicron to lock in packaging substrate, testing, and co-packaged optics (CPO) capacity through prepayments. Among these, the agreements with Ibiden, Samsung Electro-Mechanics, and Unimicron will expand semiconductor packaging substrate capacity 2.5-fold over the next three years; Ibiden's Ono plant in Japan will triple its capacity and reach full production in the first quarter of 2028. Nvidia also prepaid $1.1 billion to KYEC, doubling its total testing capacity in 2027 compared with 2026, and is working with SPIL to increase CPO optical engine capacity 15-fold by mid-2027.

Semiconductor Industry Review

NVIDIA Partners with Six Companies to Expand Substrate, Advanced Packaging, and CPO Capacity

At GTC Berlin, NVIDIA announced coordinated capacity expansion with six supply chain partners: Amkor Technology, Ibiden, King Yuan Electronics, Samsung Electro-Mechanics, Siliconware Precision Industries, and Unimicron. The expansion covers substrates, advanced packaging, testing, and optical engines. Substrate capacity is planned to increase to 2.5 times the current level over the next three years, and optical engine capacity is targeted to reach 15 times the current level by mid-2027. NVIDIA will also provide King Yuan Electronics with a $1.1 billion capacity reservation prepayment to build a new testing facility in the United States.

Wallstreetcn

Nvidia locks in over $4 billion in packaging and testing capacity at Berlin GTC; CPO equipment demand to hit an inflection point in 2027

A BofA Securities report says that at the October 21 Berlin GTC, Nvidia confirmed that its Vera Rubin GPU and CPU have entered full mass production, and made capacity commitments totaling more than $4 billion to ASE/SPIL, KYEC, and Amkor. Of this, KYEC received a $1.1 billion prepayment for a new test facility in the United States, while Amkor secured a $3 billion agreement to expand its South Korean interposer capacity by more than 300% by the end of 2028. The report argues that the AI infrastructure bottleneck has shifted from chip design to packaging and testing, that demand for CPO-related equipment is expected to grow tenfold in 2027, and that the adoption inflection point is expected in the fourth quarter of 2027.

Wallstreetcn

Goldman Sachs summarizes Nvidia's GTC Berlin keynote: DSX POD compresses data center deployment to two weeks

After Nvidia's GTC Berlin conference, the Goldman Sachs research team published a report outlining the core messages of Jensen Huang's keynote: Nvidia introduced the DSX POD modular data center solution, which can compress deployment cycles from months to two weeks, with launch expected in early 2027; capacity at three substrate suppliers—Ibiden, SEMCO and Unimicron—will expand 2.5-fold, and CoWoS packaging will expand 3-fold. Nvidia also released the OpenShell reference architecture, which enforces permission policies outside the agent via hardware triggers, and disclosed that physical AI revenue reached $11 billion in the first half of FY27, about 30% higher than all of FY26. Goldman Sachs maintains its Buy rating and 12-month price target of $300.

The Elec

Samsung Electro-Mechanics and Nvidia to Expand FC-BGA Substrate Capacity

Samsung Electro-Mechanics and Nvidia have signed a strategic partnership to jointly invest in building dedicated production lines for AI semiconductor packaging substrates at their Sejong and Busan plants, supplying FC-BGA substrates under a multi-year agreement starting in 2026. The products target AI computing chips and data center network switches, with supply volumes expected to grow at a double-digit annual rate starting in 2026, and by 2028 Nvidia-related capacity will account for a significant share of the company's total capacity. The substrates will also embed MLCCs and silicon capacitors (Si-Caps) to control power noise in ultra-high-speed computing.

ServeTheHome

NVIDIA Unveils DSX POD Container Solution and OpenShell Reference Architecture at GTC Berlin 2026

In its GTC Berlin 2026 keynote, NVIDIA unveiled the DSX POD reference design, which packs 7 Vera Rubin NVL72 racks into a shipping container, with an on-site installation period of about 14 days; partners are expected to begin global deliveries in early 2027. On the software side, it introduced the OpenShell reference architecture, using Vera Rubin for LLM inference, the Vera CPU to run agents and the OpenShell secure runtime, and the BlueField-4 DPU to handle hardware security enforcement. NVIDIA also announced supply chain expansion targets for the next three years, including a 2.5x increase in substrate capacity, a 4x increase in Amkor interposer wafers by the end of 2028, a doubling of KYEC testing capacity in 2027, and a 15x initial increase in co-packaged optics light engine capacity, followed by another doubling to 30x by the end of 2028.

icviews

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Analytics India Magazine

NVIDIA GTC Berlin 2026 announces 12 releases, covering AI factories, telecommunications, and enterprise agents

At GTC 2026 in Berlin, NVIDIA announced 12 releases, covering AI factory deployment, semiconductor manufacturing expansion, telecom AI-RAN, enterprise agents, robotics and autonomous driving, as well as new open models for enterprise data, protein design, and quantum computing. On the infrastructure side, the DSX POD modular AI factory reference design is said to shorten deployment time from six months to as little as 14 days, and DSX MaxLPS is said to deliver equivalent AI compute using up to 30% less power, with partners planning to deliver in early 2027. On the telecom side, T-Mobile completed what it calls the world's first AI-RAN call on a commercial network in Bellevue, Washington, with NVIDIA and Nokia, and Elisa completed Europe's first AI-RAN field trial; on the enterprise side, it expanded the open-source Agent Toolkit and introduced the OpenShell reference architecture for monitoring and restricting agent behavior.

unite_ai

English translation is being prepared.

nvidia_newsroomFirst-party

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caixin_tech

English translation is being prepared.