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XCENA partners with Samsung to build the CXL memory expansion device MX1. According to a Chips and Cheese report on August 30, 2026, the device can carry up to 2 TB of DDR5 memory, connects to the host via a PCIe 6/CXL 3.2 x8 interface with 64 GB/s of bandwidth in each direction, and additionally provides 8 downstream PCIe 6 lanes for connecting SSDs. The MX1 chip integrates 3072 RISC-V cores, divided into 24 128-core subsystems, is manufactured on Samsung's 4nm process, consumes 40 W at the chip level and 90 W for the whole board, and features a subsystem-level custom vector processing engine with a dot-product throughput of about 3 TFLOPS for FP32/FP16. There are currently no facts about further developments.
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Hot Chips 2026: XCENA and Samsung's Near-Memory Computing CXL Device MX1Developments
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XCENA partners with Samsung to build CXL memory expansion device MX1
Source:Chips and Cheese
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Aug 30
Chips and Cheese
Hot Chips 2026: XCENA and Samsung's Near-Memory Computing CXL Device MX1
XCENA partnered with Samsung to launch the CXL memory expansion device MX1, which can host up to 2 TB of DDR5 memory, connects to the host via a PCIe 6/CXL 3.2 x8 interface with 64 GB/s bandwidth in each direction, and additionally provides 8 downstream PCIe 6 lanes for connecting SSDs. The MX1 chip integrates 3072 RISC-V cores, divided into 24 subsystems of 128 cores each, is manufactured on Samsung's 4nm process, draws 40 W for the chip and 90 W for the whole board, and features a subsystem-level custom vector processing engine with FP32/FP16 dot-product throughput of about 3 TFLOPS.