Hot Chips 2026:对话 IBM 双 ISA z/ 架构与 Arm 设计团队
IBM 在 Hot Chips 2026 首次披露下一代 z/Architecture 处理器,同时支持 z/Architecture 与 Arm 两套指令集,采用共享解码流水线加独立解码器,并复用 TLB、缓存和物理寄存器堆等大型结构。该设计在加载存储单元内用硬件完成大小端转换,并保持强序内存模型,Arm 的 TSO 位实际不起作用。IBM 称 Arm 软件生态快速扩张,可让相关负载贴近关键业务数据与事务运行。
s talked about beyond just next-generation Telum, is your next-generation Spyre—so not Spyre 2, but next-generation Spyre. You guys have added HBM to that. I know that there was a Meta paper, I believe about two or three years ago, talking about how many errors HBM would sort of not create, but would have. IBM is all about ultra-reliability. How are you guys sort of dealing with that new memory that may have higher errors? Christian Zoellin: I’m actually not familiar with the details of that. Ar
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