Intel Panther Lake 拆解:18A 工艺、BSPDN 与 GAAFET 首秀
SemiAnalysis 拆解了 Intel Panther Lake,这是首个商用落地背面供电网络(BSPDN)的芯片,并首次采用 Intel 的 GAA 晶体管(RibbonFET)。实测显示 Panther Lake 的 18A 计算逻辑与 TSMC N3E GPU 逻辑密度相近,但 18A 峰值密度不及 TSMC N3P、N2 或 Samsung SF2。该芯片用 Foveros-S 封装整合计算、GPU 与 I/O 三颗 die,高端 GPU 仍采用 TSMC N3E。
rs on the PTL-U compute tile, both the 4-core and 12-core GPU tiles, as well as the 12-lane I/O tile. In conventional chips, power and signal are routed through the same frontside metal stack towards the device frontend. Power rails consume scarce routing resources near the transistors, while tall via stacks carry VDD and VSS from the coarse upper wires to local rails. Backside power delivery network (BSPDN) moves the main power network behind the transistor layer, to the backside, separating it
匹配字段正文

