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Jiwei.comUpdated Oct 30 16:23

Jingcun Technology Supports On-Device AI Applications with LPDDR5X Memory Solutions

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Jingcun Technology is competing for the Best Solution of the Year Award and the Outstanding Innovation of the Year Award at the 8th IC Fengyun List with its LPDDR5X high-bandwidth, low-power memory solution for on-device and edge-side AI. The solution supports up to 9600Mbps; the LPDDR5/5X series covers 1GB–32GB capacities, DQ16/32/64 bit widths, and FBGA245/315/496 and other packages; at the same bit width and channel count, 9600Mbps offers a 50% increase in theoretical data transfer rate over 6400Mbps.

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【Editor's Note】As an annual benchmark event in the semiconductor industry, the 8th IC Fengyun List is positioned at a critical window for industrial technology iteration and domestic substitution. This year's list has been fully upgraded, featuring 70 heavyweight awards covering eight core fields including AI, embodied intelligence, and smart vehicles, with multiple special awards newly added and optimized. The judging panel is composed of over 100 semiconductor investment alliance units and 500+ industry CEOs, and the winners will be announced at the 2027 Semiconductor Investment Annual Conference ceremony, fully committed to identifying industry benchmarks and establishing models of industry innovation.

【Candidate Enterprise】Shenzhen Jingcun Technology Co., Ltd. (hereinafter referred to as: Jingcun Technology)

【Candidate Awards】Annual Best Solution Award, Annual Outstanding Innovation Award

As AI phones, AI PCs, and edge intelligent devices accelerate their deployment, device-side and edge-side requirements for memory chip bandwidth, power consumption, and integration have risen to higher levels. Memory chips are no longer merely supporting components but have become key support determining terminal experience and system performance.

Under this trend, Shenzhen Jingcun Technology Co., Ltd. (abbreviated as "Jingcun Technology"), since its establishment in 2016, has grown into a national high-tech enterprise in the memory chip field with complete capabilities integrating R&D, design, production, and sales, and is establishing an increasingly prominent industry influence in the memory chip field through a complete memory solution capability layout.

Jingcun Technology's strength is first reflected in its solid R&D foundation. Its subsidiary Miaocun Technology possesses flash memory controller chip R&D capabilities and firmware development capabilities, and is a national-level specialized, refined, distinctive and innovative "little giant" enterprise, providing key support for the parent company to build an independent and controllable memory technology system. On this basis, Jingcun Technology has formed complete memory solution capabilities, with products covering NAND FLASH controller chips, eMMC, UFS, DDR3/4, LPDDR4/4X, LPDDR5/5X, eMCP, ePOP, SSD, memory modules, etc., covering consumer-grade, industrial-grade, and automotive-grade memory chips, widely used in market fields such as smartphones, Android tablets, laptops, educational electronics, Android boxes, smart TVs, intelligent terminals, smart homes, IoT, smart healthcare, industrial control equipment, and automotive electronics. From controller chips to module products, from consumer-grade to automotive-grade, Jingcun Technology has formed a complete product matrix covering mainstream memory forms.

In terms of industrial layout, Jingcun Technology is headquartered in Shenzhen, Guangdong Province, with a chip R&D center established in Zhuhai, intelligent manufacturing centers established in Shenzhen and Zhongshan, global marketing centers established in Shanghai and Shenzhen, and a global logistics and delivery center established in Hong Kong, China, forming an industrial chain layout from memory controller R&D, packaging R&D, module testing to sales. This layout enables the company to achieve full-chain collaboration from chip design to delivery services, providing stable and efficient memory support for different application scenarios, and also constitutes its differentiated advantage over single chip design or module enterprises.

This time, Jingcun Technology is competing for the "IC Fengyun List" Annual Best Solution Award and Annual Outstanding Innovation Award with its LPDDR5X high-bandwidth low-power memory solution for device-side and edge-side AI, and has become a candidate enterprise. This award is established specifically for enterprises capable of providing high-quality, innovative solutions to the industry whose products have already gained widespread recognition and praise from industry customers.

Jingcun Technology's LPDDR5X high-bandwidth low-power memory solution provides LPDDR5X running memory and platform adaptation support centered on the bandwidth, power consumption, and space requirements of AI phones, AI PCs, and edge intelligent devices. LPDDR5X supports up to 9600Mbps; the LPDDR5/5X series covers 1GB—32GB capacities, DQ16/32/64 bit widths, and packaging configurations such as FBGA245/315/496, allowing selection of corresponding combinations according to terminal processor interfaces and overall device design. Under the same bit width and channel configuration, 9600Mbps offers a 50% increase in theoretical data transfer rate compared with 6400Mbps; actual system performance needs to be evaluated in combination with platform and application loads.

"Jingcun chips, used by the world." Jingcun Technology is committed to becoming a globally leading memory technology company, driving memory technology innovation, unlocking data value, and empowering a smart future. Facing the memory upgrade demands brought by device-side and edge-side AI, Jingcun Technology is continuously providing a solid memory foundation for intelligent terminals and edge computing scenarios with its technological accumulation and high-bandwidth low-power solutions.

【Award Application Entry】

The 2027 Semiconductor Investment Annual Conference and IC Fengyun List Award Ceremony will be held in December 2026. Award applications have been launched, and collection and candidate enterprise/institution reports are currently underway. Welcome to sign up and participate, and join us at the industry feast!

【Annual Best Solution Award】

The "Annual Best Solution Award" is established specifically for enterprises capable of providing high-quality, innovative solutions to the industry whose products have already gained widespread recognition and praise from industry customers. As an enterprise's "star solution product," through the selection and endorsement of the "IC Fengyun List - Annual Best Solution Award," its market visibility will be further enhanced, and market favor and recognition for them will be strengthened at the technical level.

【Application Conditions】

1. Provide the market situation and market feedback of the applied "Solution," requiring a procurement list from major industry customers or multiple industry customers; customer names may be in code form;

2. The enterprise's products have been verified by the market, with at least one product having achieved large-scale application.

【Selection Criteria】

1. Solution innovation and quality (40%): outstanding solution innovation, mature technology, strong implementability, precise alignment with industry pain points, effective resolution of practical industry problems, and high industry adaptability and promotion value.

2. Market implementation verification (40%): at least one supporting product has achieved large-scale market application, verified in real scenarios and operating stably. Market application descriptions, procurement lists from major industry customers or multiple customers (customers may be in code form) can be provided, and implementation results are authentic and verifiable.

3. Industry reputation and recognition (20%): high market adaptability of the solution and products, good user reputation, excellent satisfaction, certain market influence in the segmented field, and value for continuous iteration and promotion.

Basic participation requirements: the application content is authentic and compliant, and supporting materials such as various implementation data, cases, and procurement lists are complete and traceable, with no false application behavior.

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