TSMC's Advanced Packaging Reportedly to Raise Prices by 10% to 20%, AI Demand Pushes Up CoWoS Capacity Pressure
Taiwanese media outlet Commercial Times, citing supply chain sources, reported that TSMC is considering raising the price of its CoWoS advanced packaging services by 10% to 20%, due to surging AI demand and persistently tight capacity in the semiconductor supply chain. Demand has expanded from GPUs to CPUs and custom ASICs, and longer AI chip testing times are further increasing packaging and testing pressure, with equipment lead times extended from 3 to 6 months to 6 to 8 months. Analysts estimate that TSMC's monthly CoWoS capacity will exceed 130,000 wafers in 2026 and reach 200,000 wafers in 2027.
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The report provides the price increase range, capacity bottlenecks and changes in equipment lead times, which can be used to gauge the degree of supply-demand tightness in the AI chip packaging segment.
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TSMC Reportedly Plans to Raise Advanced Packaging Prices by Up to 20%, as AI Demand Surges and Capacity Remains Tight
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The report noted that TSMC is preparing to implement a 10% to 20% price increase for its CoWoS (Chip on Wafer on Substrate) packaging services, a packaging technology widely used in advanced AI processors.
The report also noted that market demand has expanded from GPUs to CPUs and custom application-specific integrated circuits (ASICs), and that longer AI chip testing times have further increased pressure on packaging and testing capacity.
Because chipmakers prioritize delivery schedules, suppliers find it difficult to rapidly expand capacity, and equipment lead times have extended from the previous 3 to 6 months to 6 to 8 months.
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