TSMC's Advanced Packaging Reportedly to Raise Prices by 10% to 20%, AI Demand Pushes Up CoWoS Capacity Pressure
English text is being prepared.
Taiwanese media outlet Commercial Times, citing supply chain sources, reported that TSMC is considering raising the price of its CoWoS advanced packaging services by 10% to 20%, due to surging AI demand and persistently tight capacity in the semiconductor supply chain. Demand has expanded from GPUs to CPUs and custom ASICs, and longer AI chip testing times are further increasing packaging and testing pressure, with equipment lead times extended from 3 to 6 months to 6 to 8 months. Analysts estimate that TSMC's monthly CoWoS capacity will exceed 130,000 wafers in 2026 and reach 200,000 wafers in 2027.
Why read this
AI score 60
The report provides the price increase range, capacity bottlenecks and changes in equipment lead times, which can be used to gauge the degree of supply-demand tightness in the AI chip packaging segment.
Topics
Body
曝台积电先进封装拟涨价最高20%，因AI需求急剧攀升、产能持续吃紧IT之家下载客户端 独家抢先看2026年10月27日 14:22:55 来自山东Updated 2026年10月27日 14:29:57
IT之家 10 月 27 日消息，据台媒《工商时报》今日援引供应链消息人士报道，台积电正考虑将其先进封装工艺价格上调 10% 至 20%，原因是 AI 需求急剧攀升，导致半导体供应链产能持续吃紧。
报道指出，台积电正准备对 CoWoS（Chip on Wafer on Substrate）封装服务实施 10% 至 20% 的涨价，该封装技术被广泛应用于先进 AI 处理器。
报道还指出，市场需求已从 GPU 扩展至 CPU 及客制化特殊应用积体电路（ASIC），加上 AI 芯片测试时间延长，进一步加重了封装与测试产能的压力。
由于芯片制造商优先安排交货时程，供应商难以迅速扩大产能，设备交货期已从此前的 3 至 6 个月延长至 6 至 8 个月。
IT之家从报道了解到，根据引述的分析师预估，台积电 CoWoS 月产能预计将于 2026 年突破 13 万片晶圆，并于 2027 年达到 20 万片。
“特别声明：以上作品内容(包括在内的视频、图片或音频)为凤凰网旗下自媒体平台“大风号”用户上传并发布，本平台仅提供信息存储空间服务。
Notice: The content above (including the videos, pictures and audios if any) is uploaded and posted by the user of Dafeng Hao, which is a social media platform and merely provides information storage space services.”