The 2027 Semiconductor Investment Annual Conference and IC Fengyun Awards Ceremony will land in Chengdu in December, with the theme focusing on chip upgrades in the Agent era

The "2027 (8th) Semiconductor Investment Annual Conference and IC Top List Awards Ceremony," hosted by the Semiconductor Investment Alliance and Chengdu High-tech Investment Group, co-organized by the ICT Intellectual Property Development Alliance, and undertaken by Jiwei, will be grandly held in Chengdu on December 19, 2026. With the theme "Chip-Borne Computing Power · Agent New Era — The Path of Chip Upgrading in the Intelligent Agent Era," this year's annual conference focuses on the new opportunities for computing power infrastructure iteration, chip technology upgrading, and industrial investment and financing under the wave of Agent intelligent agents.

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Currently, the global semiconductor industry has entered a brand-new development cycle driven by intelligent agents. As AI moves from large-model inference to Agent intelligent agent implementation, it poses entirely new propositions for computing power architecture, chip design, advanced packaging, IP, and software-hardware collaboration. China's integrated circuit industry continues to grow at a high speed; in 2025, the domestic integrated circuit market size exceeded 1.8 trillion yuan, and computing power chips, third-generation semiconductors, and Chiplet achieved technological breakthroughs. Under the background of independent controllability, the two-way linkage between industry and capital has become the core engine for the industry's high-quality development. How to grasp the technological changes in the intelligent agent era and connect technological innovation, product implementation, and capital docking has become a proposition for the entire industry to ponder together.

As the core carrying area of China's western integrated circuit industry, Chengdu is making every effort to build China's integrated circuit "fourth pole." The local government has issued special policies such as the "Chengdu Integrated Circuit Industry High-Quality Development Action Plan (2023-2027)," relying on Chengdu High-tech Zone and Chengdu Chip Valley to build a "one core, multiple points" industrial layout, gathering more than 400 integrated circuit enterprises, cultivating more than 50 national specialized, refined, distinctive and innovative "little giant" enterprises and more than ten chain leader enterprises, and establishing a complete industrial system covering IC design, wafer manufacturing, packaging and testing, and equipment and materials. Bringing this annual industry event to Chengdu is not only full recognition of the strength of the Chengdu-Chongqing integrated circuit industry, but will also further activate the western industrial ecosystem and open up docking channels for industry, capital, and projects between the east and west.

Against this background, this year's annual conference, with the theme "Chip-Borne Computing Power · Agent New Era — The Path of Chip Upgrading in the Intelligent Agent Era," is committed to building an in-depth exchange platform for government, industry, academia, research, and capital in the global semiconductor field. The conference will gather heads of listed companies, partners of top investment institutions, industry experts, and representatives of innovative enterprises to conduct in-depth discussions on topics such as chip upgrading in the intelligent agent era, changes in the supply chain landscape, intellectual property going global, and the evolution of the AI industry; multiple authoritative industry reports and track white papers will be grandly released on site, providing actionable references for industrial decision-making and uncovering the technological iteration and investment and financing opportunities brought by Agent intelligent agents.

The Semiconductor Investment Annual Conference and IC Top List Awards Ceremony has been successfully held for seven sessions so far and is a highly authoritative annual gala in China's semiconductor field, an important window for the industry to observe trends, for capital to discover projects, and for parks to connect resources. One of the core IPs of the Semiconductor Investment Annual Conference — the IC Top List — upholds the principle of objectivity and fairness, relies on multi-dimensional data from the market, academia and research, and capital, and selects industry benchmarks through public solicitation, voluntary application, and expert review. This year's IC Top List features more than 70 authoritative 2027 IC Top List awards, covering multiple tracks such as investment institutions, listed companies, market innovation, AI, embodied intelligence, intellectual property, automotive electronics, and overseas markets, comprehensively discovering benchmark enterprises, institutions, and leading figures in all links of the entire industrial chain.

In addition to the authoritative list and awards ceremony, this conference features diverse exchange scenarios such as on-site enterprise visits, closed-door dinners, keynote report sessions, summit roundtables, award banquets, and special cultural experiences. Participating guests will visit representative local semiconductor enterprises and industrial parks in Chengdu on site to immersively experience the western integrated circuit business environment; the closed-door exchange session will open up dialogue channels among government, industry, and capital; post-conference cultural experience activities will build relaxed in-depth docking scenarios for entrepreneurs and investors. At present, the event has received enthusiastic registrations from numerous industrial chain enterprises and investment institutions, and candidate enterprise applications continue to advance. Representatives of listed companies, leading investment institutions, innovative enterprises, and local parks from all over the country will gather in Chengdu to compete for the major awards of the IC Top List.

The countdown to the opening of the conference has begun! As various preparatory work steadily advances, we sincerely invite enterprises and institutions across the entire industrial chain to participate in this industry event. Participating enterprises will receive the support of Jiwei's all-media matrix communication, effectively enhancing their brand influence in the core circles of the industry.

Chengdu gathers strength, and chips start a new era! As the wave of Agent intelligent agents sweeps in and computing power chips usher in entirely new transformation opportunities, let us meet in Chengdu and jointly explore new paths for China's chip upgrading in the intelligent agent era!