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AUO Chairman Peng Shuanglang said that AUO, starting from glass processing technology, is laying out metallization, redistribution layer (RDL), through-holes and interposer, with the goal of becoming an important partner to packaging fabs rather than replacing existing manufacturers. He mentioned that AI chips are getting larger and larger, and existing PCB boards may in the future be unable to meet the needs of large or high-density chips, and glass substrates are regarded as an important direction for next-generation advanced packaging. The relevant new technology platform is expected to reach a certain level of maturity in 2 to 3 years, at which time the hope is to first achieve small-volume shipments. No subsequent progress has been disclosed at present.
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AUO lays out glass substrate metallization, RDL and interposer, targeting advanced packaging for AI chipsDevelopments
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Oct 24
Jiwei.com
AUO lays out glass substrate metallization, RDL and interposer, targeting advanced packaging for AI chips
AUO Chairman Paul Peng said the company starts from glass processing technology and is laying out metallization, redistribution layer (RDL), through-holes and interposer, with the goal of becoming an important partner to packaging fabs rather than replacing existing manufacturers. As AI chips grow larger, existing PCB boards may struggle in the future to meet the needs of large or high-density chips, and glass substrates are seen as an important direction for next-generation advanced packaging. The relevant new technology platform is expected to reach a certain level of maturity in 2 to 3 years, at which point the company hopes to first achieve small-volume shipments.