Understand this story
Micron has unveiled G11, its next-generation memory chip for AI data centers. According to a report dated October 24, 2026, G11 can hold roughly twice the amount of data as the current G9 on the same silicon area, with the number of stacked layers increased from 276 to more than 400, transfer speeds improved by up to 1.5 times, and energy consumption per bit of data transfer reduced by more than 25%. The chip skips the G10 naming and was redesigned specifically for AI data centers. It is expected to enter mass production in the second half of 2027, with SSDs equipped with G11 coming to market later. Micron has not yet disclosed changes in cost per GB. There are currently no further developments.
AI-generated from public reports
Latest development · Report
Micron G11 memory chip: double the capacity, 25% better energy efficiencyDevelopments
1 confirmed developments
- Source:Rohan Paul
Reports and discussion timeline
Browse reports and discussion by time. Their evidence levels remain distinct.
Oct 24
Rohan Paul
Micron G11 memory chip: double the capacity, 25% better energy efficiency
Micron's next-generation memory chip G11 can hold roughly twice the amount of data as the current G9 on the same silicon area, with the number of stacked layers increasing from 276 to more than 400, transfer speeds up to 1.5 times higher, and energy consumption per bit of data transfer reduced by more than 25%. The chip skips the G10 naming and was redesigned specifically for AI data centers. It is expected to enter mass production in the second half of 2027, with SSDs equipped with G11 launching later. Micron has not yet disclosed changes in cost per GB.