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TSMC is reportedly preparing to raise CoWoS advanced packaging prices once again, by as much as 20%. A report dated October 27, 2026, said this round of price increases stems from AI packaging demand exceeding supply, with demand having expanded from GPUs to server CPUs and custom ASICs, and foundries and packaging houses are expected to raise prices by 10% to 20%. The same report noted that equipment lead times have lengthened from 3 to 6 months to 6 to 8 months, and that larger package sizes will also reduce per-tool hourly output. TSMC Chairman C.C. Wei said that packaging reaching 5 times the largest printable chip is already in mass production with excellent yield, and 9x and 14x solutions are in planning. Separately, a Taiwanese media outlet, citing supply chain sources, said TSMC is considering raising CoWoS prices by 10% to 20%, and analysts estimate its monthly CoWoS capacity will exceed 130,000 wafers in 2026 and reach 200,000 wafers in 2027. There is currently no further official confirmation.
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Oct 28
East Money
NVIDIA plans to invest $3 billion for an equity stake in Meta, deepening Muse large model cooperation; TSMC plans to raise CoWoS packaging quotes by up to 20%
NVIDIA announced it is expanding cooperation with Meta in the AI assistant Muse and related large model fields, and will make a $3 billion equity investment in Meta. Meta will expand deployment of next-generation infrastructure including the Vera Rubin architecture, Vera CPU, Spectrum-X Ethernet, and BlueField-4. TSMC and other wafer foundry and packaging/testing companies are preparing to raise CoWoS packaging quotes, with increases of up to 20%, and their monthly CoWoS capacity is expected to exceed 130,000 wafers in 2026.
Oct 27
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Phoenix TechnologyRelated discussion
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East Money
TSMC Plans to Raise CoWoS Prices by 10% to 20%, Advanced Packaging Capacity in Critical Shortage
Driven by explosive AI demand and tight supply chain capacity, TSMC plans to raise CoWoS packaging prices by 10% to 20%. Its monthly CoWoS capacity is expected to exceed 130,000 wafers in 2026 and rise to 200,000 wafers in 2027. TrendForce data shows that even including the new capacity added by outsourced packaging and testing providers, the industry supply-demand gap in 2026 will still be about 20%. More than 100 advanced packaging concept stocks in the A-share market have a combined total market value of about 4.47 trillion yuan, and 23 of them were increased by margin traders in the past week.
East MoneyRelated discussion
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This post contributes to heat; it is not a formal report or confirmed fact.
Phoenix Technology
TSMC's Advanced Packaging Reportedly to Raise Prices by 10% to 20%, AI Demand Pushes Up CoWoS Capacity Pressure
Taiwanese media outlet Commercial Times, citing supply chain sources, reported that TSMC is considering raising the price of its CoWoS advanced packaging services by 10% to 20%, due to surging AI demand and persistently tight capacity in the semiconductor supply chain. Demand has expanded from GPUs to CPUs and custom ASICs, and longer AI chip testing times are further increasing packaging and testing pressure, with equipment lead times extended from 3 to 6 months to 6 to 8 months. Analysts estimate that TSMC's monthly CoWoS capacity will exceed 130,000 wafers in 2026 and reach 200,000 wafers in 2027.
East Money
TSMC's CoWoS Packaging Reportedly to Raise Prices 10% to 20%, AI Packaging and Testing Capacity Remains Tight
Affected by the explosion in AI demand and comprehensive tightness in semiconductor supply chain capacity, TSMC plans to raise CoWoS packaging quotes by 10% to 20%. This technology is widely used in high-end AI processors, and demand has extended from GPUs to server CPUs and custom ASICs, while chip equipment lead times have also lengthened from 3 to 6 months to 6 to 8 months. Analysts expect TSMC's monthly CoWoS capacity to potentially exceed 130,000 wafers in 2026 and rise to 200,000 wafers in 2027.
Wallstreetcn
TSMC Plans to Raise CoWoS Advanced Packaging Prices by 10%-20%, Nvidia and AMD Face Cost Pressure
According to a report by Taiwan's Commercial Times citing supply chain sources, TSMC is considering raising prices for advanced packaging processes by 10% to 20%, with the core product being the CoWoS packaging technology used to integrate chips with HBM. The report says TSMC's monthly CoWoS capacity is expected to exceed 130,000 wafers in 2026 and further increase to more than 200,000 wafers in 2027. The price increase will directly push up production costs for major chip companies such as Nvidia and AMD, and Apple's hardware products may also come under pressure from the combined packaging and memory costs.
Rohan Paul
TSMC CoWoS Packaging Reportedly to Raise Prices Again, with Increases of Up to 20%
TSMC is reportedly preparing to raise CoWoS packaging prices again, with increases of up to 20%, because AI packaging demand exceeds supply. Demand has expanded from GPUs to server CPUs and custom ASICs, and foundries and packaging houses are expected to raise prices by 10% to 20%. Equipment lead times have stretched from 3-6 months to 6-8 months, and larger package sizes will also reduce the per-tool hourly output. TSMC Chairman C.C. Wei said that packaging with an area 5 times that of the largest printable chip has entered mass production with excellent yield, and 9x and 14x plans are in planning.
Heat trend for this story
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- 47 Oct 27 16:00
- 24-hour change
- -13%
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