壁仞科技再融4.04亿港元，为BR20X芯片备货
Chinese AI chipmaker Biren Technology is raising another HK$4.04 billion ($520 million) through a share placement, its second in three months. Including its Jan
中国AI芯片公司壁仞科技通过配股再融资4.04亿港元（约5200万美元），这是其三个月内的第二次配股，加上1月IPO，不到一年累计募资近170亿港元。公司将以每股31.08港元发行1.3亿股，较7月配股价折让33%，约70%的新资金用于供应链采购和商业化，主要支持下一代BR20X芯片的生产准备。壁仞称供应商正在涨价并延长交付周期，客户则要求其保证大额订单的交付能力；公司2026年上半年营收大增、亏损收窄，但公告后10月8日股价下跌11.85%。
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Chinese AI chipmaker Biren Technology is raising another HK$4.04 billion ($520 million) through a share placement, its second in three months. Including its January IPO, the company has raised nearly HK$17 billion in less than a year.
Biren will sell 130 million shares at HK$31.08 each, a 33% discount to its July placement price. The latest funds will mainly support supply-chain purchases and production preparation for its next-generation BR20X chip.
Biren says suppliers are raising prices and extending delivery times, while customers are demanding greater assurance that it can fulfill large orders. About 70% of the new proceeds will go toward supply-chain procurement and commercialization.
The company’s revenue surged in the first half of 2026 and its losses narrowed, but its shares fell 11.85% on October 8 after the announcement.