单相直接液冷如何应对 AI 超高密度算力散热
Single-Phase Direct Liquid Cooling Is Proven for the Next Decade of Ultra-Dense Compute - Wiley Science and Engineering Content Hub
IEEE Spectrum 发布白皮书，介绍单相直接液冷如何应对 AI 与高性能计算的散热需求：现代 AI 加速器功耗可超过 1,000 瓦，单机架散热超过 100 千瓦，已超出风冷实际能力。该方案通过冷板循环水或水乙二醇冷却液，在闭环中将热量带至冷却液分配单元，并与两相液冷和浸没式冷却进行对比。
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This White Paper provides a comprehensive overview of how single-phase direct liquid cooling manages the rising thermal demands of AI and high-performance computing, and how it compares with two-phase and immersion approaches.
What you will learn about:
Why rising compute density has made heat the central design constraint in AI and high-performance computing, where individual processors now exceed 1,000 watts and racks dissipate more than 100 kilowatts; How semiconductors respond to excess heat through thermal throttling, and why maintaining thermal margin supports higher performance and longer hardware life; Why air cooling reaches its practical limit at high rack densities, and how liquid absorbs and carries away far more heat in a closed loop; How single-phase direct liquid cooling works at the chip and system levels, and how it compares with two-phase and immersion cooling; How processor power and rack density are expected to grow, and what these trends mean for the future of thermal design
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As computing systems move toward denser processors, tightly coupled server nodes, and higher-power racks, managing the heat they generate has become a defining challenge in data center design. Modern AI accelerators can dissipate well over 1,000 watts, and a single rack may release more than 100 kilowatts of heat. This is far beyond what air cooling can practically remove. Single-phase direct liquid cooling addresses this by circulating water or a water-glycol coolant through coldplates mounted directly on high-heat components. The coolant absorbs the heat and carries it away in a closed loop to a coolant distribution unit. Because liquid stores far more heat than air and removes it much faster, this approach supports higher chip and rack densities within a smaller footprint. This paper explains how single-phase direct liquid cooling works, how it compares with two-phase and immersion cooling, and how rising processor power and rack density are shaping the future of thermal
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IEEE Spectrum Magazine, the flagship publication of the IEEE, explores the development, applications and implications of new technologies. It anticipates trends in engineering, science, and technology, and provides a forum for understanding, discussion and leadership in these areas.
1. Same tier 3 topics + same partner [3],