Nvidia 向三星电机、Ibiden 等六家供应商预付扩产，锁定 AI 基础设施产能
Nvidia Invests in AI Supply Chain to Expand Production Capacity
Nvidia 于 10 月 21 日宣布与三星电机、Ibiden、Amkor、KYEC、SPIL 和 Unimicron 合作，通过预付款锁定封装基板、测试和共封装光学（CPO）产能。其中与 Ibiden、三星电机、Unimicron 的协议将在未来三年把半导体封装基板产能扩大 2.5 倍，Ibiden 日本 Ono 工厂产能将增至三倍并于 2028 年一季度全面投产。Nvidia 还向 KYEC 预付 11 亿美元，使其 2027 年测试总产能较 2026 年翻倍，并与 SPIL 合作在 2027 年中把 CPO 光引擎产能提升 15 倍。
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Nvidia is collaborating with Samsung Electro-Mechanics, Ibiden, Amkor Technology, KYEC, SPIL and Unimicron. (Photo: Nvidia)
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Nvidia is investing to meet growing demand for artificial intelligence (AI) infrastructure. The company is making advance payments to key suppliers to secure capacity for semiconductor packaging substrates, testing and co-packaged optics (CPO).
Nvidia said Oct. 21 local time it is working with Samsung Electro-Mechanics, Ibiden, Amkor Technology, King Yuan Electronics Co. (KYEC), Siliconware Precision Industries (SPIL) and Unimicron to meet rising demand for AI factories. “We’re in the middle of the largest infrastructure buildout in human history,” Nvidia chief executive officer Jensen Huang said. “Demand is enormous, but capacity is constrained.”
Nvidia is expanding agreements with substrate manufacturers Ibiden, Samsung Electro-Mechanics and Unimicron to increase semiconductor package substrate production capacity 2.5-fold over the next three years. These substrates provide electrical connections and transmit signals between chips and main circuit boards. Flip-chip ball grid array (FC-BGA) substrates used in AI servers are a representative example.
Nvidia has reserved several billion dollars worth of production capacity at Ibiden and made advance payments. The investment aims to triple production capacity at the company’s Ono plant in Japan. The additional capacity is expected to begin full-scale operations in the first quarter of 2028.
Samsung Electro-Mechanics will also begin supplying next-generation semiconductor package substrates from its South Korean production facilities in 2026. Nvidia will support equipment upgrades at Samsung Electro-Mechanics’ Sejong and Busan plants, as well as construction of a new factory.
Nvidia has also signed a capacity reservation agreement with Unimicron to support expansion of its KF plant in Taiwan. Capacity will begin increasing in the second quarter of 2027 and is expected to reach full utilization by mid-2028.
In advanced packaging, Nvidia is working with Amkor to expand production capacity in Gwangju, South Korea. The company plans to increase interposer wafer production capacity by more than 300% by the end of 2028. Interposers serve as intermediate connections between chips and package substrates.
Nvidia is also expanding semiconductor testing capacity. It has committed $1.1 billion in advance payments to reserve capacity at Taiwanese testing company KYEC. Expansion of facilities in the United States, Taiwan and Singapore will double total semiconductor testing capacity in 2027 from the 2026 level. A new U.S. testing facility is scheduled to begin mass production in April 2027, while expanded production lines in Singapore will begin mass production in February 2027.
Nvidia is also working with SPIL to expand optical engine production capacity for CPO in Taiwan. Capacity will increase 15-fold by mid-2027 and double again by the end of 2028. The expansion aims to secure next-generation optical signal components.