Gaonchips 将用三星 8nm 工艺为 KAI 下一代无人机开发 AI 芯片
Gaonchips to Develop AI Chip for Next-Generation Drones Using Samsung 8nm Process < Semiconductor < 기사본문 - The Elec Inc.
Gaonchips 宣布参与韩国航空航天工业公司（KAI）的下一代无人系统 AI 半导体开发项目，将采用三星 8nm 代工工艺实现国产 NPU 与雷达信号处理技术，并负责整颗芯片的物理设计与最终设计验证。该项目属于韩国产业通商资源部支持的 K-On-Device AI 半导体技术开发项目，由 Supergate 主导开发，目标是打造可让无人机在通信受限环境下独立执行任务的 AI SoC。KAI 负责无人平台的系统集成与验证。
正文
当前显示原文，中文全文译文尚未就绪。
가
The body content of the article will be changed to this letter size.
스크롤 이동 상태바
Gaonchips will participate in KAI’s AI semiconductor development project for next-generation unmanned systems. (Photo: Gaonchips)
Gaonchips said on Oct. 19 it will participate in the development of an artificial intelligence (AI) semiconductor for next-generation unmanned systems operated by Korea Aerospace Industries (KAI).
Gaonchips will serve as a joint research and development partner in an aerial unmanned platform project overseen by KAI under the K-On-Device AI Semiconductor Technology Development Project, supported by the Ministry of Trade, Industry and Resources (MOTIR). Supergate is the lead developer.
The project aims to develop an AI system-on-chip (SoC) that will serve as the brain of next-generation expendable unmanned aerial vehicles. The SoC integrates multiple semiconductor circuits with different functions onto a single chip. It will enable drones to run AI and carry out missions independently through on-device processing, even in operational environments where communications are disrupted or limited.
Gaonchips will implement a domestically developed neural processing unit (NPU) and radar signal processing technology using Samsung Electronics’ 8-nanometer (nm) foundry process. The company will handle physical design and final design verification of the entire chip. Physical design involves translating logical circuits into actual patterns on a semiconductor wafer.
KAI will be responsible for system integration and verification of the unmanned platform, incorporating operational requirements and conditions from defense applications. Supergate will lead the AI chip architecture design and software development.
Gaonchips has accumulated experience in developing and mass-producing 5nm on-device AI semiconductors. It has also worked on next-generation 2nm AI chips and an AI accelerator design project for a Japanese customer using a 2nm gate-all-around (GAA) process and 2.5D packaging. The company is currently involved in other advanced-process projects, including an automotive AI semiconductor development project under the K-On-Device AI Semiconductor Technology Development Project.
“We will work closely with KAI and other participating organizations to validate domestically developed AI semiconductors on actual defense platforms and ensure they meet the required performance and reliability standards,” said Woo Jung-ho, executive vice president of Gaonchips. “We will also strengthen our capabilities in AI semiconductor design and commercialization tailored to various systems and application environments.”
JEONG IL JOO 1week@thelec.kr
My comment