Genesem 获全球前三芯片厂商独家 AI 切割分离设备订单

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South Korean semiconductor back-end equipment maker Genesem will exclusively supply saw singulation equipment equipped with artificial intelligence (AI) inspection capabilities to a major global semiconductor manufacturer, identified as Company A, and its outsourced packaging partners.

Company A ranks among the world’s three largest semiconductor manufacturers by revenue among companies operating their own fabrication facilities.

Starting in 2027, all newly installed saw singulation equipment within the customer’s manufacturing ecosystem will be supplied by Genesem, according to information obtained by THE ELEC.

Industry sources said on Oct. 19 that Genesem developed GVISION AI+, which combines AI vision and deep-learning vision technology in its saw singulation equipment, and passed the customer’s mass-production qualification testing in the third quarter.

Development began in 2025, followed by the installation and validation of several pilot machines at production sites in 2026.

Deliveries in 2027 are expected to total approximately 20 machines, with a contract value exceeding 30 billion won.

Saw singulation equipment cuts molded substrates into individual semiconductor packages. This differs from wafer dicing, which separates wafers into individual dies.

After singulation, vision cameras inspect the exterior of each package to distinguish acceptable products from defective ones.

Conventional inspection systems have applied conservative standards to avoid missing defects. As a result, some acceptable products have been incorrectly classified as defective and discarded.

One example involves inspection systems failing to distinguish between actual process defects and foreign particles merely attached to a package’s surface.

Genesem has reduced such misclassifications by applying on-device AI, allowing a deep-learning model embedded in the equipment to evaluate foreign particles directly.

Genesem is the first company in the industry to apply on-device AI technology to saw singulation equipment.

Company A recognized the benefits of the technology and decided that all newly purchased saw singulation equipment would incorporate the AI inspection system.

The technology can improve mass-production efficiency by recovering acceptable products that would otherwise be discarded.

Two of Company A’s outsourced semiconductor packaging partners have also decided to adopt the same equipment to comply with the chipmaker’s inspection standards.

Both memory and logic semiconductor packages that undergo substrate mounting and molding require saw singulation.

Industry observers say the inspection standards validated through this project could eventually spread to other semiconductor manufacturers and outsourced semiconductor assembly and test (OSAT) providers.

According to securities industry estimates, saw singulation equipment has typically accounted for approximately 35% of Genesem’s revenue.

That proportion is expected to exceed 50% in 2027 as sales of the new AI-equipped systems begin contributing to revenue.

“I understand that adding AI capabilities has increased equipment prices by more than 10% compared with existing models,” an industry official said. “The new equipment is also expected to make a substantial contribution to profitability.”

Securities analysts expect Genesem to generate approximately 80 billion won in revenue in 2026, supported by increased investment from semiconductor customers.

The company reported revenue of 56.8 billion won in 2025.

If the forecast is realized, Genesem would surpass its previous annual revenue record of 68.7 billion won, set in 2024.

JY Han powerusr@thelec.kr

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