三星电机与英伟达将扩大 FC-BGA 基板产能
Samsung Electro-Mechanics, Nvidia to Expand FC-BGA Production
三星电机（Samsung Electro-Mechanics）与英伟达（Nvidia）签署战略合作，将在世宗和釜山工厂联合投资建设 AI 半导体封装基板专用产线，从 2026 年起按多年协议供应 FC-BGA 基板。产品面向 AI 计算芯片和数据中心网络交换机，供应量预计自 2026 年起以两位数年增速增长，到 2028 年英伟达相关产能将占公司总产能的显著份额。基板还将嵌入 MLCC 和硅电容（Si-Caps）以控制超高速计算中的电源噪声。
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Samsung Electro-Mechanics’ FC-BGA substrate for servers. (Source: Samsung Electro-Mechanics)
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Samsung Electro-Mechanics will jointly invest with Nvidia to establish dedicated production facilities for artificial intelligence (AI) semiconductor package substrates at its Sejong and Busan plants. The company’s plan to expand package substrate production lines through customer-backed investment, under consideration since the first half of 2026, has taken shape through its partnership with Nvidia.
Samsung Electro-Mechanics said on Oct. 21 that it had signed a strategic business partnership with Nvidia to supply semiconductor package substrates. The company will supply next-generation substrates from its Korean production facilities under a multiyear arrangement beginning in 2026.
The products include flip-chip ball grid array (FC-BGA) substrates for AI computing chips and network switches that enable high-speed connections between chips in data centers. Supply volumes are expected to grow at a double-digit annual rate starting in 2026. By 2028, Nvidia-related production is expected to account for a significant share of the company’s total capacity.
The substrates will also embed passive components, including multilayer ceramic capacitors (MLCCs) and silicon capacitors (Si-Caps). These components will help control power noise generated during ultra-high-speed computing and maximize power efficiency.
“We will combine our accumulated expertise in advanced FC-BGA manufacturing with our unrivaled high-reliability MLCC technology to ensure Nvidia’s AI platforms reach the market on time with the highest performance and quality,” said Chang Duck-hyun, president of Samsung Electro-Mechanics.
“Expanding production capacity globally is essential to keep pace with the speed of AI infrastructure deployment,” said Deborah Shoquist, executive vice president of operations at Nvidia. “Through our partnership with Samsung Electro-Mechanics, we will broaden our network of substrate supply partners and deliver the accelerated computing platforms our customers need.”