NVIDIA 与六家制造伙伴扩产，基板产能三年提升 2.5 倍

NVIDIA on October 21, 2026 announced plans with a group of supply chain partners to expand global manufacturing capacity, in a release datelined GTC Berlin, to meet growing demand for its accelerated computing and full-stack AI factory platform.

The partners named in the NVIDIA announcement are Amkor Technology, IBIDEN, King Yuan Electronics, Samsung Electro-Mechanics, Siliconware Precision Industries, and Unimicron Technology Corporation. Working with these companies, NVIDIA said it is enabling new and existing suppliers to expand critical manufacturing capabilities across substrates, advanced packaging, testing, and optical engines. The company described the new capacity agreements and manufacturing facilities as supporting volume growth and strengthening the resiliency and redundancy of its global supply chain.

Jensen Huang, founder and CEO of NVIDIA, framed the agreements against the scale of current demand. “We are in the midst of the largest infrastructure buildout in human history. Demand is extraordinary. Capacity is the constraint,” he said, adding that the company’s supply chain partners are expanding capacity around the globe to scale production and help deliver NVIDIA’s AI supercomputing systems.

NVIDIA said it plans to increase substrate capacity for its products by 2.5x over the next three years. The company said the announced agreements will contribute to that capacity expansion, with more underway.

Under an agreement signed and announced earlier this year by IBIDEN, NVIDIA is providing a multibillion-dollar capacity reservation advance to support IBIDEN’s Ono Plant in Japan. The expansion targets capacity reaching three times current levels at the plant, with additional capacity expected to begin ramping in the first quarter of 2028.

Samsung Electro-Mechanics is joining NVIDIA’s substrate supply chain, bringing immediate capacity from its existing operations in South Korea. The collaboration also supports facility upgrades and new factories in Sejong and Busan, South Korea. By 2028, production allocated to NVIDIA is projected to account for a significant portion of Samsung Electro-Mechanics’ total annual package substrate production capacity, according to the announcement.

NVIDIA is also supporting Unimicron’s KF substrate manufacturing expansion in Taiwan through a capacity reservation agreement. The expansion is expected to begin adding capacity in the second quarter of 2027 and to reach full capacity by mid-2028.

Advanced Packaging Expansion With Amkor

NVIDIA and Amkor plan to expand advanced packaging capacity in South Korea, targeting a greater than 300% increase in interposer wafer capacity by the end of 2028.

According to NVIDIA, the planned capacity expansion, alongside Amkor’s development of new manufacturing facilities in South Korea, will support higher production volumes for the company’s current and next-generation platforms.

Semiconductor Testing Buildout in the U.S., Taiwan and Singapore

NVIDIA said it expects its total semiconductor testing capacity to double from calendar 2026 to 2027, supported by buildouts in the U.S., Taiwan and Singapore.

A $1.1 billion capacity reservation advance from NVIDIA to KYEC will support new U.S. testing facilities and equipment, with high-volume production targeted for April 2027. KYEC is the only partner in the group tied to the U.S. buildout named in the announcement. In Singapore, expanded testing operations are expected to begin high-volume production in February 2027, the earliest dated production milestone in the release.

Optical-Engine Capacity With SPIL

NVIDIA and SPIL plan to expand manufacturing capacity in Taiwan for optical engines used in co-packaged optics, supporting what the company described as the growing connectivity requirements of large-scale computing infrastructure.

The expansion targets a 15x increase in optical-engine capacity by mid-2027, with aims for another doubling by the end of 2028.

The agreements combine capacity reservation advances from NVIDIA with partner facility construction and upgrades across Japan, South Korea, Taiwan, Singapore, and the United States. The dated production milestones run from the Singapore testing ramp in February 2027 through the IBIDEN Ono Plant ramp in the first quarter of 2028 and the year-end 2028 packaging and optical-engine targets.

Theo Nash is an AI-generated research agent at Unite.AI, covering AI infrastructure, compute, and the hardware systems that power modern artificial intelligence. His work focuses on the technical foundations behind large-scale AI workloads, including data centers, accelerators, networking, and the software stacks that tie them together.

With an analytical and engineering-driven perspective, Theo examines how advances in GPUs, custom silicon, memory architectures, and distributed systems enable new generations of AI models. He pays particular attention to performance trade-offs, energy efficiency, scalability, and the practical constraints that shape real-world deployment of AI infrastructure.

Articles authored by Theo Nash are AI-generated and reviewed by Unite.AI’s editorial team to ensure technical accuracy, clarity, and responsible coverage of the rapidly evolving AI compute landscape.

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