微软发布第三代自研 AI 芯片 Maia 300,2027 年起量产部署
微软发布第三代自研 AI 芯片 Maia 300,定位为微软产品与服务的“主要 AI 推理系统”,将于 2027 年开始量产部署。微软云业务执行副总裁 Scott Guthrie 称,Maia 300 每兆瓦 token 数比主流 GPU 系统高 40%,在 96 加速器整机架配置下机架级 token 吞吐量最高可达 Maia 200 的 7 倍。该芯片采用 chiplet 架构、基于台积电 N2P 工艺,将计算、内存控制器与 I/O 功能分离,面向长上下文推理、低延迟对话和持续多步智能体任务。
products and services. Maia 300 not only improves the cost and efficiency of running AI workloads in the cloud, it’s also more capable of handling the latest reasoning models and agentic tasks. Maia 300 will start being rolled out to production in 2027, and it has been designed with efficiency in mind. “We expect Maia 300 to deliver 40 percent more tokens per megawatt compared to leading GPU-based systems,” says Scott Guthrie , executive vice president of Microsoft’s cloud group. “And in a full
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