Intel Panther Lake 拆解:18A 工艺、BSPDN 与 GAAFET 首秀
SemiAnalysis 拆解了 Intel Panther Lake,这是首个商用落地背面供电网络(BSPDN)的芯片,并首次采用 Intel 的 GAA 晶体管(RibbonFET)。实测显示 Panther Lake 的 18A 计算逻辑与 TSMC N3E GPU 逻辑密度相近,但 18A 峰值密度不及 TSMC N3P、N2 或 Samsung SF2。该芯片用 Foveros-S 封装整合计算、GPU 与 I/O 三颗 die,高端 GPU 仍采用 TSMC N3E。
dependent range make scaling and model validation part of deployment. Hardware activation functions further reduce work that would otherwise occupy the programmable DSPs. [1], [2] Microsoft requires an NPU to deliver at least 40 TOPS for Copilot+ PCs. Both Lunar Lake and Panther Lake meet this threshold, but Panther Lake uses significantly less silicon. GPU tiles Panther Lake is Intel’s first product with Xe3, its latest GPU architecture. It offers two different GPU tiles: a smaller GT1 tile wit
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