Weinan Hexin Completes Over 1 Billion Yuan C2 Round of Financing, Cumulative Financing of 3 Billion Yuan in Half a Year
Hangzhou-based compute-in-memory AI chip company Weinan Hexin has completed an over 1 billion yuan C2 round of financing, led by Jiantou Investment, with the funds used for product development iteration and supply chain mass production stocking. Combined with the C1 round completed in September, the company raised over 2 billion yuan within two months and a cumulative 3 billion yuan in half a year. Its 3D-CIM architecture targets large model inference; all three chips for edge-side and cloud-side have been taped out, with customer sampling and the start of mass supply expected in early 2027.
Hangzhou-based compute-in-memory AI chip company Weinan Hexin has completed an over 1 billion yuan C2 round of financing, led by Jiantou Investment, with the funds used for product development iteration and supply chain mass production stocking. Combined with the C1 round completed in September, the company raised over 2 billion yuan within two months and a cumulative 3 billion yuan in half a year. Its 3D-CIM architecture targets large model inference; all three chips for edge-side and cloud-sid
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