AI Semiconductor Industry Trends: From Single Chips to System-Level Competition
AI semiconductor competition is shifting from individual chips to a system-level contest spanning packaging, racks, and supply chains, with connectivity having replaced compute as the bottleneck in AI infrastructure. Qualcomm has introduced High Bandwidth Compute aimed at tokens per watt, Intel is using EMIB to scale packaging from 3x to more than 10x, and Lattice has released its first AI design assistant, Lattice Prompt. AI agents are compressing chip development cycles to 6 to 9 months.
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