Beken Corporation is a candidate for the "Annual AI Market Breakthrough Award" at the 8th IC Industry Awards with its high-performance edge AI chip BK7259. The BK7259 adopts an M52+M55 dual-core architecture and an ARM Ethos U65 NPU, providing 0.25 TOPS of edge-side computing power. It is the first to integrate the Ethos-U65 microNPU into a Wi-Fi 6 MCU, with deep sleep current as low as 2µA, and completes edge-side 3D facial recognition in about 200ms.
On October 15, Malaysian customs seized 30 servers equipped with high-performance AI chips in the free trade zone at Kuala Lumpur airport, with a cargo value of about US$12.11 million; the goods had been declared as ordinary electronic components. Authorities believe the shipment originated in one Asian country and was intended for re-export to another Asian country, and suspect that an organized smuggling network is behind it, using Malaysia as a transit point to circumvent export restrictions. No one has been arrested so far, and the companies involved have been summoned to assist with the investigation. This is the fifth case authorities have identified as linked to the network; in June, 72 AI servers were seized in the same free trade zone, and according to The Information, the total value of the related seizures is about US$24 million. In 2025, Malaysia adopted the Strategic Trade Controller directive, imposing additional controls on the export, transit and transshipment of high-performance AI chips, computer systems and electronic components.
On October 15, Malaysian customs seized 30 servers equipped with high-performance AI chips in the free trade zone at Kuala Lumpur airport, with a cargo value of about US$12.11 million; the goods had been declared as ordinary electronic components. Authorities believe the shipment originated in one Asian country and was intended for re-export to another Asian country, and suspect that an organized smuggling network is behind it, using Malaysia as a transit point to circumvent export restrictions.
China's Ministry of Commerce and Ministry of Science and Technology issued Announcement No. 48 of 2026 on October 16, proposing to add 40 items to the Catalogue of Technologies Prohibited or Restricted from Export in China, of which 14 are prohibited from export and 26 are restricted from export, and to implement pre-export registration for all newly added technologies effective immediately. The draft sets three thresholds for frontier models: ≥10^26 FLOP, ≥2T parameters, or reaching a globally leading level, and also covers AI chip design, memory chips, ten-thousand-card-level clusters, agents, AIGC detection tools, training data, and cyber offense and defense capabilities; scenarios such as open source, self-built overseas data centers, and overseas tape-out may use the report-and-export channel. The public comment period runs until November 15.
China's Ministry of Commerce and Ministry of Science and Technology issued Announcement No. 48 of 2026 on October 16, proposing to add 40 items to the Catalogue of Technologies Prohibited or Restricted from Export in China, of which 14 are prohibited from export and 26 are restricted from export, and to implement pre-export registration for all newly added technologies effective immediately. The draft sets three thresholds for frontier models: ≥10^26 FLOP, ≥2T parameters, or reaching a globally
Hangzhou-based compute-in-memory AI chip company Weinan Hexin has completed an over 1 billion yuan C2 round of financing, led by Jiantou Investment, with the funds used for product development iteration and supply chain mass production stocking. Combined with the C1 round completed in September, the company raised over 2 billion yuan within two months and a cumulative 3 billion yuan in half a year. Its 3D-CIM architecture targets large model inference; all three chips for edge-side and cloud-side have been taped out, with customer sampling and the start of mass supply expected in early 2027.
Hangzhou-based compute-in-memory AI chip company Weinan Hexin has completed an over 1 billion yuan C2 round of financing, led by Jiantou Investment, with the funds used for product development iteration and supply chain mass production stocking. Combined with the C1 round completed in September, the company raised over 2 billion yuan within two months and a cumulative 3 billion yuan in half a year. Its 3D-CIM architecture targets large model inference; all three chips for edge-side and cloud-sid
The Shanghai Municipal Commission of Economy and Informatization issued the "Shanghai Action Plan for Accelerating the High-Quality Development of AI-Empowered Industrial Services (2027-2028)," proposing that by 2028 the AI application penetration rate in the industrial services sector reach over 85%, strive to cultivate 10 digital-intelligent native unicorn enterprises, build 5 industry-level collaborative design platforms, and promote 500 high-quality enterprises to build Shanghai advanced-level smart factories. The plan focuses on full-chain upgrading across R&D and design, supply chain services, flexible manufacturing, embedded quality inspection, and predictive operation and maintenance deployment, and provides up to 20 million yuan in support for technical breakthroughs such as intelligent production scheduling and dispatching hubs, AI inspection equipment, and predictive operation and maintenance. The plan also proposes supporting industrial agent task planning and swarm collaboration, developing lightweight vertical small models adapted to self-developed AI chips, and providing up to 5 million yuan in subsidies for enterprises calling third-party large model APIs or deploying them privately.
The Shanghai Municipal Commission of Economy and Informatization issued the "Shanghai Action Plan for Accelerating the High-Quality Development of AI-Empowered Industrial Services (2027-2028)," proposing that by 2028 the AI application penetration rate in the industrial services sector reach over 85%, strive to cultivate 10 digital-intelligent native unicorn enterprises, build 5 industry-level collaborative design platforms, and promote 500 high-quality enterprises to build Shanghai advanced-lev
Huawei has obtained a $2.25 billion seven-year offshore loan from six Chinese banks, with the funds to be used for AI chip R&D, research, and inventory stockpiling for storage. Even as buyers such as DeepSeek plan large-scale deployment of its accelerators, production output remains strictly limited. Huawei's R&D investment in the first half of the year was $17 billion, with negative cash flow reaching $5.6 billion.
The first all-electric SUV jointly developed by Volkswagen and XPeng, the ID.UNYX 08, sold only 267 units per month on average from April to August 2026, about 7.4% of the internal target of 3,622 units. The car features an 800V platform and dual Turing AI chips with 1,500 TOPS, but the RMB 200,000-class market is fiercely competitive, and it is sold mainly through Volkswagen Anhui's independent network, which had only 166 outlets at the time of reporting. The two sides completed mass production in 24 months, while product definition, channels and pricing remained decisions made by Volkswagen itself.
The first all-electric SUV jointly developed by Volkswagen and XPeng, the ID.UNYX 08, sold only 267 units per month on average from April to August 2026, about 7.4% of the internal target of 3,622 units. The car features an 800V platform and dual Turing AI chips with 1,500 TOPS, but the RMB 200,000-class market is fiercely competitive, and it is sold mainly through Volkswagen Anhui's independent network, which had only 166 outlets at the time of reporting. The two sides completed mass production