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MediaTek announced that former Intel Executive Vice President Navid Shahriari will join the company on November 9 as Senior Vice President, reporting directly to the President and Chief Operating Officer. According to Jiwei.com, he will be responsible for teams covering advanced process and yield platforms, design-technology co-optimization, and advanced testing and packaging; he has more than 37 years of experience in semiconductor design and advanced packaging, and one of his priorities after taking office will be deepening MediaTek's cooperation with supply chain partners such as TSMC. According to TrendForce, MediaTek is collaborating with Intel on EMIB technology for some cloud ASIC projects while also supporting TSMC's CoWoS, forming a dual-route packaging strategy.
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MediaTek Hires Former Intel Executive Shahriari, Pursuing Dual-Track Packaging with CoWoS and EMIBDevelopments
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MediaTek announces that Navid Shahriari will serve as Senior Vice President
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Nov 6
Electronic Technology Application
MediaTek Hires Former Intel Executive Shahriari, Pursuing Dual-Track Packaging with CoWoS and EMIB
TrendForce reports that former Intel Executive Vice President Naveed Shahriari will join MediaTek on November 9 as Senior Vice President, reporting directly to the President and Chief Operating Officer, overseeing advanced process and yield platforms, design-technology co-optimization, advanced testing and packaging, and related areas. MediaTek is collaborating with Intel on EMIB technology for some cloud ASIC projects while also supporting TSMC's CoWoS, forming a dual-track packaging strategy. Its first AI accelerator ASIC began shipping in September 2026, is expected to generate approximately $2.5 billion in revenue in the fourth quarter, and targets approximately $16 billion in AI ASIC revenue and about 20% market share in 2027.
Nov 5
Jiwei.com
Former Intel packaging head Navid Shahriari joins MediaTek as Senior Vice President
Navid Shahriari, former Executive Vice President of Packaging and Testing, Foundry Technology and Manufacturing Operations at Intel, will join MediaTek on November 9 as Senior Vice President, reporting to the General Manager and Chief Operating Officer, and will be responsible for teams including advanced process and yield platforms, design-technology co-optimization, and advanced testing and packaging. He has more than 37 years of experience in semiconductor design and advanced packaging, and one of his priorities after taking office will be deepening MediaTek's cooperation with supply chain partners such as TSMC. MediaTek is advancing a dual-track packaging route of TSMC CoWoS and Intel EMIB, and some cloud computing ASIC projects have already adopted EMIB.
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